Effect of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 154-165

  Yao, Daping ^a   Shang, Jian Ku ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Cooling rate; Fatigue crack growth; Fatigue threshold; Interface; Intermetallic; Reflow; Solder

Indexed keywords

COOLING; CRACK PROPAGATION; CRACKS; EFFECTS; EUTECTICS; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; KINETIC THEORY; MORPHOLOGY; SOLDERING ALLOYS;

AIR COOLING; COOLING RATE; FATIGUE THRESHOLD; FLEXURAL PEEL SPECIMEN; FURNACE COOLING; STRAIN ENERGY RELEASE RATE; WATER QUENCHING;

SOLDERED JOINTS;

EID: 0030086027     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486498     Document Type: Article

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