Effect of AI and Zn alloying elements on Sn-3.8Ag-0.7Cu and Sn-3.6Ag solder reaction with Cu and Ni(P) substrate

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10

Volumn , Issue , 2010, Pages 17-21

  Kotadia, H R ^a   Mokhtari, O ^a   Bottrill, M ^a   Clode, M P ^a   Green, M A ^a   Mannan, S H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

Interfacial reactions; Intermetallic; Pb free solder; Sn Ag alloys; Sn Ag Cu alloys

Indexed keywords

ACTIVE ELEMENTS; ADDITION OF AL; ADVERSE EFFECT; BARRIER LAYERS; CU SUBSTRATE; ELECTRONICS APPLICATIONS; EUTECTIC STRUCTURES; HIGH TEMPERATURE; IMC LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; MINOR ALLOYING; OPTIMUM CONCENTRATION; PB FREE SOLDERS; PHASE IDENTIFICATION; QUALITATIVE AND QUANTITATIVE ANALYSIS; REACTIVE ELEMENTS; REFLOW--SOLDERING; SEM; SN-AG ALLOYS; SN-AG-CU; SN-AG-CU ALLOY; SOLDER ALLOYS; SOLDER JOINT MICROSTRUCTURE; SOLDER VOLUME; SOLDER WETTING; WETTING PROBLEMS; WETTING PROCESS;

ADDITION REACTIONS; ALLOYING; ALLOYING ELEMENTS; ALLOYS; ALUMINUM; CHIP SCALE PACKAGES; COPPER ALLOYS; ELECTROCHEMICAL ELECTRODES; EUTECTICS; FLIP CHIP DEVICES; OPTICAL MICROSCOPY; PACKAGING; PACKAGING MATERIALS; PEOPLE MOVERS; QUALITY CONTROL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; WETTING; ZINC;

TIN;

EID: 77952399166     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2010.5441387     Document Type: Conference Paper

References (10)

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