SCOPUS 정보 검색 플랫폼

Volumn 157, Issue 6, 2010, Pages

Mechanical and microstructural characterization of through-silicon via fabricated with constant current pulse-reverse modulation

(3) Lin, Nay a Miao, Jianmin a Dixit, Pradeep b

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

b VTT TECHNICAL RESEARCH CENTRE OF FINLAND (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT CURRENT; COPPER INTERCONNECTION; COPPER PILLARS; DIELECTRIC LAYER; ELECTROPLATED COPPER; GRAIN SIZE; MECHANICAL CHARACTERIZATIONS; MICRO ELECTRO MECHANICAL SYSTEM; MICRO RAMAN SPECTROSCOPY; MICRO-STRUCTURAL; MICRO-STRUCTURAL CHARACTERIZATION; NANOINDENTATION TESTS; REVERSE CURRENTS; THROUGH-SILICON VIA; YOUNG'S MODULUS;

COPPER; ELASTIC MODULI; ELASTICITY; HARDNESS; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; NANOINDENTATION; RAMAN SPECTROSCOPY;

COPPER DEPOSITS;

EID: 77958550739 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3368707 Document Type: Article

Times cited : (6)

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