Effect of isothermal aging on room temperature impression creep of lead free Sn-9Zn and Sn-8Zn-3Bi solders

Materials Science and Technology

Volumn 26, Issue 8, 2010, Pages 1001-1007

  Mahmudi, R ^a   Geranmayeh, A R ^b   Noori, H ^a   Khanbareh, H ^a   Jahangiri, N ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

^b ISLAMIC AZAD UNIVERSITY   (Iran)

Author keywords

Aging; Creep; Impression; Lead free solders

Indexed keywords

AGING; AS CAST MICROSTRUCTURE; AS-CAST; CREEP BEHAVIOUR; CREEP RESISTANT; IMPRESSION; IMPRESSION CREEP; ISOTHERMAL AGING; LEAD FREE SOLDERS; LEAD-FREE; MATRIX; PROCESSING CONDITION; ROOM TEMPERATURE; SN-8ZN-3BI; SOLDER ALLOYS; STEADY STATE CREEP RATE; STRESS EXPONENTS; UNIFORM DISTRIBUTION; ZN PARTICLES;

AGING OF MATERIALS; ALLOYS; CREEP; CREEP RESISTANCE; CREEP TESTING; MATERIALS TESTING; MICROSTRUCTURE; PRECIPITATES; PRECIPITATION (CHEMICAL); SOLDERING ALLOYS; TIN ALLOYS; ZINC;

TIN;

EID: 77956383788     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/174328409X410845     Document Type: Article

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