Impression creep behaviour of tin based lead free solders

Materials Science and Technology

Volumn 20, Issue 3, 2004, Pages 403-408

  Rani, S Devaki ^a   Murthy, G S ^b  

^a JNTUH COLLEGE OF ENGINEERING   (India)

^b ANDHRA UNIVERSITY   (India)

Author keywords

Impression creep; Solders; Tin alloys

Indexed keywords

ACTIVATION ANALYSIS; CREEP; ENTHALPY; HEATING; SOLDERING ALLOYS; STRESS ANALYSIS; TIN;

ELECTRONIC PACKAGES; IMPRESSION CREEP;

LEAD;

LEAD; TIN; ZINC;

ARTICLE; CHEMICAL COMPOSITION; CHEMICAL STRUCTURE; ELECTRONICS; ENTHALPY; HEATING; STEADY STATE; STRESS; STRUCTURE ANALYSIS; TEMPERATURE DEPENDENCE; VELOCITY;

EID: 1642421764     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708304225012161     Document Type: Article

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