Creep of dilute tin based lead free solder alloys as replacements of Sn-Pb solders

Materials Science and Technology

Volumn 24, Issue 7, 2008, Pages 803-808

  Mahmudi, R ^a   Geranmayeh, A R ^b   Noori, H ^a   Nayyeri, G ^a   Pishbin, F ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

^b ISLAMIC AZAD UNIVERSITY   (Iran)

Author keywords

Creep; Impression; Indentation; Lead free solders; Stress exponent

Indexed keywords

ALLOYS; BRAZING; COPPER; COPPER ALLOYS; CREEP; LEAD; LEAD ALLOYS; METALLIC COMPOUNDS; SOLDERING ALLOYS; TIN ALLOYS; TITANIUM COMPOUNDS; WELDING; ZINC;

IMPRESSION; INDENTATION; LEAD FREE SOLDERS; PURE SN; STRESS EXPONENT;

TIN;

EID: 51349113934     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328408X307274     Document Type: Article

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