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Thin Solid Films

Volumn 518, Issue 17, 2010, Pages 4898-4907

Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiNx:H films

(4) King, Sean a Chu, Rosalie a Xu, Guanghai a Huening, Jennifer a

a INTEL CORPORATION (United States)

Author keywords

Fracture toughness; Nanoindentation; Plasma CVD; Silicon nitride; Stress

Indexed keywords

CHEMICAL VAPOR DEPOSITED; FILM PROPERTIES; FILM STRESS; FRACTURE TOUGHNESS MEASUREMENTS; FRACTURE TOUGHNESS VALUES; HYDROGEN CONTENTS; INTRINSIC STRESS; LINEAR CORRELATION; PLASMA CVD; YOUNG'S MODULUS;

FRACTURE; NANOINDENTATION; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMAS; REGRESSION ANALYSIS; SILICON NITRIDE;

FRACTURE TOUGHNESS;

EID: 77955663709 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2010.03.031 Document Type: Article

Times cited : (65)

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