A study on resistance of PECVD silicon nitride thin film to thermal stress-induced cracking

Applied Surface Science

Volumn 140, Issue 1-2, 1999, Pages 12-18

  Jo, Myung Chan ^a   Park, Sang Kwon ^b   Park, Sang Joon ^c  

^a Dongseo University   (South Korea)

^b Dongguk University   (South Korea)

^c Gachon University   (South Korea)

Author keywords

52.75. Rx; 68.60. p; 81.15. Gh; PECVD; Residual stress; Silicon nitride; Thin film; Ultimate strain

Indexed keywords

CRACK INITIATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SILICON NITRIDE; STRAIN; THERMAL STRESS;

CRACK RESISTANCE;

THIN FILMS;

EID: 0033075492     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(98)00366-3     Document Type: Article

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