Stress evaluation of radio-frequency-biased plasma-enhanced chemical vapor deposited silicon nitride films

Journal of Applied Physics

Volumn 83, Issue 7, 1998, Pages 3865-3870

  Maeda, Masahiko ^a   Ikeda, Koichi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000571734     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.366618     Document Type: Article

References (25)

1. A. K. Sinha, H. J. Levinstein, T. E. Smith, G. Quintana, and S. E. Haszko, J. Electrochem. Soc. 125, 601 (1978).
2. A. Sherman, Thin Solid Films 113, 135 (1984).
3. S. Konaka, Y. Yamamoto, and T. Sakai, Extended Abstract of the 16th (1984 International) Conference on Solid State Devices and Materials, Kobe (Business Center for Academic Societies Japan, Tokyo, 1984), p. 209.
4. H. Miyanaga, S. Konaka, Y. Yamamoto, and T. Sakai, in Ref. 3, p. 225.
5. R. F. Bunshah and C. V. Deshpandey, J. Vac. Sci. Technol. A 3, 553 (1985).
6. V. S. Dharmadhikari, Thin Solid Films 153, 459 (1987).
7. A. K. Sinha, H. J. Levinstein, and T. E. Smith, J. Appl. Phys. 49, 2423 (1978).
8. T. F. Retajczyk, Jr. and A. K. Sinha, Thin Solid Films 70, 241 (1980).
9. G. M. Samuelson and K. M. Mar, J. Electrochem. Soc. 129, 1773 (1982).
10. P. Paduschek, Ch. Höpfl, and H. Mitlehner, Thin Solid Films 110, 291 (1983).
11. C. Blaauw, J. Appl. Phys. 54, 5064 (1983).
12. W. A. P. Claassen, W. G. J. N. Valkenburg, M. F. C. Willemsen, and W. M. V. D. Wljgert, J. Electrochem. Soc. 132, 893 (1985).
13. K. Allaert, A. V. Calster, H. Loos, and A. Lequesne, J. Electrochem. Soc. 132, 1763 (1985).
14. J. Kanicki and N. Voke, Mater. Res. Soc. Symp. Proc. 68, 167 (1986).
15. R. S. Martin, E. P. van de Ven, and C. P. Lee, Proceedings of the IEEE VLSI Multilevel Interconnect Conference, Santa Clara, CA, June, 1988 (unpublished), p. 286.
16. R. W. Hoffman, Phys. Thin Films 3, 211 (1966).
17. A. K. Sinha and T. E. Smith, J. Appl. Phys. 49, 2756 (1978).
18. M. Maeda and Y. Arita, J. Appl. Phys. 53, 6852 (1982).
19. G. G. Stoney, Proc. R. Soc. London, Ser. A 82, 172 (1909).
20. W. B. Brantley, J. Appl. Phys. 44, 534 (1973).
21. Corning Glass Works, Engineering with Glass, General Properties Chart, 1962.
22. P. J. Burkhardt and R. F. Marvel, J. Electrochem. Soc. 116, 864 (1969).
23. Thermophysical Properties of Matter, the TIPRC Data Series vol. 13 (Thermophysical Properties and Research Center, Purdue University, 1977), pp. 154 and 358.
24. V. Y. Doo, D. R. Nichols, and G. A. Silvey, J. Electrochem. Soc. 113, 1279 (1966).
25. D. S. Cambel, Handbook of Thin Film Technology, edited by L. I. Maissel and R. Glang (McGraw-Hill, New York, 1970), Chap. 12.