Massive stress changes in plasma-enhanced chemical vapor deposited silicon nitride films on thermal cycling

Thin Solid Films

Volumn 460, Issue 1-2, 2004, Pages 7-16

  Hughey, Michael P ^a   Cook, Robert F ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

Chemical vapor deposition; Heat treatment; Silicon nitride; Stress

Indexed keywords

ELASTIC MODULI; EVAPORATION; HARDNESS; HEAT TREATMENT; HYDROGEN BONDS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; TENSILE STRESS; THERMAL CYCLING; THERMAL EXPANSION;

FILM MODULUS; SILICON NITRIDE FILMS; STRESS CHANGES;

THIN FILMS;

EID: 2942568047     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.01.047     Document Type: Article

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