Nanoindentaion techniques for assessing mechanical reliability at the nanoscale

Microelectronic Engineering

Volumn 69, Issue 2-4, 2003, Pages 519-527

  Volinsky, Alex A ^a   Gerberich, William W ^b  

^a MOTOROLA INC   (United States)

^b UNIVERSITY OF MINNESOTA   (United States)

Author keywords

Adhesion; Interconnects; Low K dielectrics; Mechanical reliability; Nanoindentation

Indexed keywords

ADHESION; ELASTIC MODULI; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; HARDNESS; INDENTATION; PERMITTIVITY; THIN FILMS;

NANOINDENTATION TECHNIQUES;

MICROELECTRONIC PROCESSING;

EID: 0141679617     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00341-1     Document Type: Conference Paper

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