Indentation fracture of low-dielectric constant films: Part II. Indentation fracture mechanics model

Journal of Materials Research

Volumn 23, Issue 9, 2008, Pages 2443-2457

  Morris, Dylan J ^a   Cook, Robert F ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC CAPACITORS; DIELECTRIC WAVEGUIDES; ESTIMATION; FRACTURE; FRACTURE FIXATION; FRACTURE MECHANICS; LITHOGRAPHY; MAGNETIC FILMS; MOLECULAR BEAM EPITAXY; NONMETALS; PERMITTIVITY; SILICON; SPEED; STRENGTH OF MATERIALS; STRESSES; SUBSTRATES; SULFATE MINERALS;

CRITICAL FILM THICKNESS; DIELECTRIC CONSTANTS; FILM FRACTURE; FILM STRESSES; FILM-THICKNESS; FRACTURE MODELLING; FRACTURE RESPONSE; INDENTATION FRACTURE; INDENTATION FRACTURE MECHANICS; INDEPENDENT MEASUREMENT; INSTRUMENTED INDENTATION; RADIAL FRACTURES; SILICON SUBSTRATES;

FRACTURE TOUGHNESS;

EID: 52649094973     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0295     Document Type: Article

References (38)

1. D.J. Morris and R.F. Cook: Indentation fracture of low-dielectric constant films: Part I. Experiments and observations. J. Mater. Res. 23(9), 2429 (2008).
2. D.J. Morris and R.F. Cook: Radial fracture during indentation by acute probes: I. Description by an indentation wedging model. Int. J. Fract. 136, 237 (2005).
3. B.R. Lawn: Fracture of Brittle Solids (Cambridge University Press, Cambridge, UK, 1993).
4. G.R. Anstis, P. Chantikul, B.R. Lawn, and D.B. Marshall: A critical evaluation of indentation techniques for measuring fracture toughness. I. Direct crack measurements. J. Am. Ceram. Soc. 64, 533 (1981).
5. D.M. Marsh: Plastic flow and fracture of glass. Proc. R. Soc. London A 282, (1965).
6. A. Arora, D.B. Marshall, B.R. Lawn, and M.V. Swain: Indentation deformation/fracture of normal and anomalous glasses. J. Non-Cryst. Solids 31, 415 (1979).
7. R.F. Cook and G.M. Pharr: Direct observation and analysis of indentation cracking in glasses and ceramics. J. Am. Ceram. Soc. 73, 787 (1990).
8. D.J. Morris, S.B. Myers, and R.F. Cook: Sharp probes of varying acuity: Instrumented indentation and fracture behavior. J. Mater. Res. 19, 165 (2004).
9. D.J. Morris, A.M. Vodnick, and R.F. Cook: Radial fracture during indentation by acute probes: II, Experimental observations of cube-corner and vickers indentation. Int. J. Fract. 136, 265 (2005).
10. G.M. Pharr, D.S. Harding, and W.C. Oliver: Measurement of fracture toughness in thin films and small volumes using nanoindentation methods, in Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures, edited by M. Nastasi, D.M. Parkin, and H. Gleiter (NATO ASI, Boston, MA, 1993) p. 449.
11. D.J. Morris and R.F. Cook: In situ cube-corner indentation of soda-lime glass and fused silica. J. Am. Ceram. Soc. 87, 1494 (2004).
12. H. Tada, P.C. Paris, and G.R. Irwin: The Stress Analysis of Cracks Handbook (ASME Press, New York, 2000).
13. H. Gao, C-H. Chiu, and J. Lee: Elastic contact versus indentation modeling of multi-layered materials. Int. J. Solids Struct. 29, 2471 (1992).
14. H. Xu and G.M. Pharr: An improved relation for the effective elastic compliance of a film/substrate system during indentation by a flat cylindrical punch. Scr. Mater. 55, 315 (2006).
15. J. Mencik, D. Munz, E. Quandt, E.R. Weppelmann, and M.V. Swain: Determination of elastic modulus of thin layers using nanoindentation. J. Mater. Res. 12, 2475 (1997).
16. H. Song, G.M. Pharr, and A. Rar: Assessment of new relation for the elastic compliance of a film-substrate system, in Thin Films: Stresses and Mechanical Properties I, edited by C.S. Ozkan, L.B. Freund, R.C. Cammarata, and H. Gao (Mater. Res. Soc. Symp. Proc. 695, Warrendale, PA, 2002) p. 431.
17. J.L. Beuth: Cracking of thin bonded films in residual tension. Int. J. Solids Struct. 29, 1657 (1992).
18. A.R. Zak and M.L. Williams: Crack point singularities at a bimaterial interface. J. Appl. Mech. 30, 142 (1963).
19. J.W. Hutchinson and Z. Suo: Mixed mode cracking in layered materials. Adv. Appl. Mech. 29, 63 (1992).
20. J. Dundurs: Discussion of edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading. J. Appl. Mech. 36, 650 (1969).
21. J.J. Vlassak: Channel cracking in thin films on substrates of finite thickness. Int. J. Fract. 120, 299 (2003).
22. T. Suga, G. Elssner, and S. Schmauder: Composite parameters and mechanical compatibility of material joints. J. Compos. Mater. 22, 917 (1988).
23. B.N. Lucas, J.C. Hay, and W.C. Oliver: Using multidimensional contact experiments to determine Poisson's ratio. J. Mater. Res. 19, 58 (2004).
24. B.N. Lucas, J.C. Hay, and W.C. Oliver: Using multi-dimensional contact mechanics experiments to measure Poisson's ratio of porous low-k films, in Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003, edited by A.J. McKerrow, J. Leu, O. Kraft, and T. Kikkawa (Mater. Res. Soc. Symp. Proc. 766, Warrendale, PA, 2003) p. 177.
25. K.E. Evans and A. Alderson: Auxetic materials: Functional materials and structures from lateral thinking! Adv. Mater. 12, 617 (2000).
26. W. Yang, Z-M. Li, W. Shi, B-H. Xie, and M-B. Yang: Review on auxetic materials. J. Mater. Sci. 39, 3269 (2004).
27. A. Alderson and K.E. Evans: Molecular origin of auxetic behavior in tetrahedral framework silicates. Phys. Rev. Lett. 89, 2255031 (2002).
28. T.C.T. Ting and T. Chen: Poisson's ratio for anisotropic elastic materials can have no bounds. Q. J. Mech. Appl. Math. 58, 73 (2005).
29. R.S. Lakes: Negative Poisson's ratio materials. Science 238, 551 (1987).
30. G. Simmons and H. Wang: Single Crystal Elastic Constants and Calculated Aggregate Properties: A Handbook (MIT Press, Cambridge, MA, 1971).
31. T.Y. Tsui, A.J. McKerrow, and J.J. Vlassak: Constraint effects on thin film channel cracking behavior. J. Mater. Res. 20, 2266 (2005).
32. T. Nakamura and S.M. Kamath: Three-dimensional effects in thin film fracture mechanics. Mech. Mater. 13, 67 (1992).
33. J.M. Jacques, T.Y. Tsui, A.J. McKerrow, and R. Kraft: Environmental effects on crack characteristics for OSG materials, in Thin Films - Stresses and Mechanical Properties XI, edited by T.E. Buchheit, A.M. Minor, R. Spolenak, and K. Takashima (Mater. Res. Soc. Symp. Proc. 875, Warrendale, PA, 2005). O10.6
34. S.M. Wiederhorn: Fracture surface energy of glass. J. Am. Ceram. Soc. 52, 99 (1969).
35. J.J. Petrovic: Review: Mechanical properties of ice and snow. J. Mater. Sci. 38, 1 (2003).
36. G.D. Quinn and R.C. Bradt: On the Vickers indentation fracture toughness test. J. Am. Ceram. Soc. 90, 673 (2007).
37. A.A. Volinsky, J.B. Vella, and W.W. Gerberich: Fracture toughness, adhesion and mechanical properties of low-k dielectric thin films measured by nanoindentation. Thin Solid Films 429, 201 (2003).
38. J.B. Vella, I.S. Adhihetty, K. Junker, and A.A. Volinsky: Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications. Int. J. Fract. 120, 487 (2003).