Grain growth enhancement of electroplated copper film by supercritical annealing

Japanese Journal of Applied Physics

Volumn 49, Issue 5 PART 3, 2010, Pages

  Ueno, Kazuyoshi ^a   Shimada, Yuji ^a   Yomogida, Shigeru ^a,b   Akahori, Seishi ^a,c   Yamamoto, Tomohiko ^a,c   Yamaguchi, Takamasa ^a   Aoki, Yoshinori ^a   Matsuyama, Akiko ^a,b   Yata, Takashi ^a,b   Hashimoto, Hideki ^a,c  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

^b Kisco Ltd   (Japan)

^c TORAY RESEARCH CENTER INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING METHODS; CU SURFACES; ELECTROPLATED COPPER FILM; ELECTROPLATED CU FILMS; GRAIN STRUCTURES; SECONDARY IONS; SUPERCRITICAL; SURFACE MIGRATION;

ANNEALING; COPPER; FILM GROWTH; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; METALLIC FILMS; OXYGEN; X RAY PHOTOELECTRON SPECTROSCOPY;

GRAIN GROWTH;

EID: 77953158724     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.49.05FA08     Document Type: Article

References (24)

1. International Technology Roadmap for Semiconductors (2007) Interconnect, p. 4.
2. W. Steinhogl, G. Schindler, G. Steinlesberger, M. Traving, and M. Engelhardt: J. Appl. Phys. 97 (2005) 023706.
3. E. H. Sondheimer: Adv. Phys. 1 (1952) 1.
4. A. F. Mayadas and M. Shatzkes: Phys. Rev. B 1 (1970) 1382.
5. W. F. A. Besling, M. Broekaart, V. Arnal, and J. Torres: Microelectron. Eng. 76 (2004) 167.
6. V. Carreau, S. Maitrejean, M. Verdier, Y. Brechet, A. Roule, A. Toffoli, V. Delaye, and G. Passemard: Microelectron. Eng. 84 (2007) 2723.
7. W. Wu, D. Ernur, S. H. Brongersma, M. Van Hove, and K. Maex: Microelectron. Eng. 76 (2004) 190.
8. G. B. Alers, J. Sukamto, S. Park, J. Blackburn, C. Chi, I. Kalinovski, W. Wu, and R. Powell: Copper Resistivity Workshop, 2005, No. 14.
9. V. Carreau, S. Maitrejean, Y. Brechet, M. Verdier, D. Bochu, and G. Passemard: Microelectron. Eng. 85 (2008) 2133.
10. K. Ueno, K. Shimotani, Y. Shimada, S. Yomogida, T. Takeshita, A. Hashimoto, and T. Yata: Proc. 24th Advanced Metallization Conf., 2009, p. 283.
11. J. W. King and L. L. Williams: Curr. Opin. Solid State Mater. Sci. 7 (2003) 413.
12. G. L. Weibel and C. K. Ober: Microelectron. Eng. 65 (2003) 145.
13. E. Kondoh and K. Shigama: Thin Solid Films 491 (2005) 228.
14. T. Momose, T. Ohkubo, M. Sugiyama, and Y. Shimogaki: Thin Solid Films 517 (2008) 674.
15. C. Ventosa, D. Rebiscoul, V. Perrut, V. Ivanova, O. Renault, and G. Passemard: Microelectron. Eng. 85 (2008) 1629.
16. E. Kondoh and J. Fukuda: J. Supercrit. Fluids 44 (2008) 466.
17. J. M. E. Harper, C. Cabral, Jr., P. C. Andricacos, L. Gignac, I. C. Noyan, K. P. Rodbell, and C. K. Hu: J. Appl. Phys. 86 (1999) 2516.
18. Z. R. Xu and R. B. McLellan: Scr. Mater. 39 (1998) 365.
19. C. Detavernier, S. Rossnagel, C. Noyan, S. Guha, C. Cabral, and C. Lavoie: J. Appl. Phys. 94 (2003) 2874.
20. J.-M. Paik, Y.-J. Park, M.-S. Yoon, J.-H. Lee, and Y.-C. Joo: Scr. Mater. 48 (2003) 683.
21. M. Stangl, M. Liptak, A. Fletcher, J. Acker, J. Thomas, H. Wendrock, S. Oswald, and K. Wezig: Microelectron. Eng. 85 (2008) 534.
22. A. Wikstrom and M. Nygards: Acta Mater. 50 (2002) 857.
23. J. M. E. Harper and K. P. Rodbell: J. Vac. Sci. Technol. B 15 (1997) 763.
24. O. Dubreuil, M. Cordeau, Th. Mourier, P. Chausse, M. Mellier, D. Bellet, and J. Torres: Microelectron. Eng. 85 (2008) 1988.