Grain growth of electroplated copper film by alternative annealing methods

Advanced Metallization Conference (AMC)

Volumn , Issue , 2009, Pages 283-287

  Ueno, Kazuyoshi ^a   Shimotani, Kouichiro ^a   Shimada, Yuji ^a   Yomogida, Shigeru ^b   Takeshita, Takato ^a   Hashimoto, Akiko ^b   Yata, Takashi ^b  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

^b Kisco Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING METHODS; CURRENT STRESS; ELECTROPLATED COPPER; ELECTROPLATED COPPER FILM; ELECTROPLATED CU FILMS; GRAIN SIZE; JOULE HEATING EFFECT; ROOM TEMPERATURE;

ANNEALING; COPPER; EFFLUENT TREATMENT; FILM GROWTH; GRAIN SIZE AND SHAPE; METALLIC FILMS; METALLIZING; SUPERCRITICAL FLUIDS;

GRAIN GROWTH;

EID: 70349969400     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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