High quality laser microeutting of difficult-to-cut materials - Copper and silicon wafer

ICALEO 2002 - 21st International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Volumn , Issue , 2002, Pages

  Lim, G C ^a   Mai, Tuan Anh ^a   Low, David ^a   Chen, Qiong ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b Advanced Systems Automation Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEBRIS; ELECTRIC CONDUCTIVITY; LASER BEAMS; LASERS; METALLIC COMPOUNDS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; PASSIVATION; POWER QUALITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON ALLOYS; SILICON WAFERS; SUBSTRATES;

BURR FORMATIONS; CONVENTIONAL METHODS; CUT EDGES; CUTTING SPEEDS; EXCESSIVE HEATS; HIGH ELECTRICAL CONDUCTIVITIES; HIGH PRECISIONS; HIGH QUALITIES; KERF WIDTHS; LASER CUTTINGS; METALLISATION; MICRO-ELECTRO-MECHANICAL SYSTEMS; OPTICAL-; SCANNING ELECTRON MICROSCOPES; SPATIAL CHARACTERISTICS; THIN SILICON WAFERS;

LASER BEAM CUTTING;

EID: 57049176547     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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