Laser technology for wafer dicing and micro via drilling for next generation wafers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5713, Issue , 2005, Pages 54-66

  Toftness, Richard F ^a   Boyle, Adrian ^a   Gillen, David ^a  

^a Xsil Ltd   (Ireland)

Author keywords

Die strength; Laser micromachining; Laser via drilling; Thin wafer dicing

Indexed keywords

DRILLING; HEAT AFFECTED ZONE; MICROMACHINING; Q SWITCHING; SAWING; SEMICONDUCTOR LASERS; SILICON; SOLID STATE LASERS; ULTRAVIOLET DEVICES;

DIE STRENGTH; LASER MICROMACHINING; LASER VIA DRILLING; THIN WAFER DICING;

LASER APPLICATIONS;

EID: 23744460687     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.602033     Document Type: Conference Paper

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