Laser machining of silicon using diode-pumped solid state & CO 2 lasers

ICALEO 2002 - 21st International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Volumn , Issue , 2002, Pages

  Corboline, T ^a   Hoult, A P ^a  

^a Laser Applications Center ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE; CARBON DIOXIDE LASERS; DIODES; PRINTED CIRCUIT BOARDS; PUMPING (LASER); SILICON WAFERS;

DIODE PUMPED SOLID STATE LASER; DIODE-PUMPED; HIGH AVERAGE POWER; INDUSTRIAL ACCEPTANCE; LASER CUTTING; LASER MACHINING; ULTRA VIOLET; WAFER MATERIAL;

SOLID STATE LASERS;

EID: 84902230979     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2351/1.5065750     Document Type: Conference Paper

References (13)

1. Hoult AP, Lasers: The Best Prescription for Processing Medical Materials. Medical Design News, pp. 16-22, April 2002.
2. Harder T, Reinert W, Low-Profile and Flexible Electronic Assemblies using ultra-thin Silicon - The European FLEX-SI Project. ICAPS 2002, Reno, Nevada, March 2002.
3. Duley WW, Laser Processing and Analysis of Materials. Ch. 3, pp 177. Plenum Press, 1983. ISBN 0-306-41067-2.
4. Yoo JH, Jeong SH, Mao XL, Greif R & Russo RE. App. Phys. Lett. 76, no. 6, pp 783-785, Feb 2000.
5. Shirk MD, Molian PA. J. Laser Applications, vol. 10. no. 1, pp 18-28, Feb. 1998.
6. Kaufmann T, Fraunhoffer F, Dorner J. 'Laser water-jet based dicing'. European Semiconductor, vol. 22, no. 4, pp S109-10, April 2000.
7. th Euro Photovoltaic solar Energy Conf. Munich, Germany, Oct. 2001.
8. LIA Handbook of Laser Mat. Proa., Ed; Ready JF. Ch. 4, pp 138.ISBN: 0-912035-15-3.
9. nd ed. Springer ISBN3-540-59401-9.
10. rd ed. ISBN 3-540-66891-8.
11. Govorkov et al. Proc. SPIE, vol. 4065, (2000). pp 790-800.
12. Chang JJ, Warner BE, Dragon EP & Martinez MW. J. Laser Apps., Vol. 10, no. 6, Dec. 1998, pp 285-291.
13. nd ed. Springer, ISBN 3-540-19786-9.