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Volumn 6458, Issue , 2007, Pages

Enhancing silicon cutting performance by shaping the focused beam

Author keywords

Elliptical beam; Fracture strength; Laser cutting; Silicon

Indexed keywords

ELLIPTICAL BEAM; LASER CUTTING; MECHANICAL CUTTING;

EID: 34248403366     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.708642     Document Type: Conference Paper
Times cited : (8)

References (9)
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  • 2
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  • 3
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    • Braun, D. et al, "Improved throughput of deep high-aspect-ratio trenches using split-beam laser ablation", High-Power Laser Ablation VI, SPIE,.Vol. 6261, 6261-84, 2006
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    • Braun, D.1
  • 4
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    • Advances in Laser Singulation of Silicon
    • Migliore, L. et al, "Advances in Laser Singulation of Silicon", ICALEO 2006, pp. 237-242, 2006
    • (2006) ICALEO 2006 , pp. 237-242
    • Migliore, L.1
  • 5
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    • Focusing of spherical Gaussian beams
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  • 6
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    • UV laser micromachining of silicon, indium phosphide and lithium niobate for telecommunications applications, Opto-Ireland 2002
    • Greuters, J. and Rizvi, N., "UV laser micromachining of silicon, indium phosphide and lithium niobate for telecommunications applications, Opto-Ireland 2002, SPIE, Vol. 4876, pp. 479-486, 2003
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    • US Patent 7,148,447, GSI Group 2006
    • US Patent 7,148,447, GSI Group (2006)
  • 9
    • 34248402350 scopus 로고    scopus 로고
    • Perrottet, D. et al, Heat damage-free Laser-Microjet cutting achieves highest die fracture strength, Photonics West 2005, SPIE, Vol5713, 5713-42, 2005
    • Perrottet, D. et al, "Heat damage-free Laser-Microjet cutting achieves highest die fracture strength", Photonics West 2005, SPIE, Vol5713, 5713-42, 2005


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.