Micro-machining of silicon and glass with picosecond lasers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5662, Issue , 2004, Pages 717-721

  Račiukaitis, Gediminas ^a,b   Brikas, Marijus ^b  

^a EKSPLA LTD   (Lithuania)

^b CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

Author keywords

Ablation; Cutting; Drilling; Micromachining; Picosecond laser; Silicon

Indexed keywords

CONTINUOUS WAVE LASERS; CUTTING; DRILLING; GLASS; HEAT AFFECTED ZONE; LASER ABLATION; LASER BEAMS; LASER PULSES; MICROMACHINING; Q SWITCHED LASERS; SILICON;

MICROSYSTEMS; OPTIMAL PULSE DURATION; PICOSECOND LASER; SHORT PULSES;

LASER APPLICATIONS;

EID: 20344390774     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.596604     Document Type: Conference Paper

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