Laser ablation with water micro-drop for dicing of silicon wafer

ICALEO 2004 - 23rd International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Volumn , Issue , 2004, Pages

  Shimizu, Kouki ^a   Takahashi, Kunimitsu ^a   Morikazu, Hiroshi ^b   Ogoshi, Nobumori ^b   Takeyama, Koichi ^b   Wakayama, Yoji ^c   Obara, Tetsuro ^d  

^a INSTITUTE OF RESEARCH AND INNOVATION   (Japan)

^b DISCO CORPORATION   (Japan)

^c LINTEC CORPORATION   (Japan)

^d SAITAMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABLATION; DEPOSITION; DROPS; LASER ABLATION; LASER PULSES; PIEZOELECTRIC ACTUATORS;

ABLATED PARTICLES; CONSTANT SPEED; DELAY TIME; FLEXURAL STRESS; LASER DICING; MICRO NOZZLE; SURFACE CONDITIONS; WAFER SURFACE;

SILICON WAFERS;

EID: 85088179040     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2351/1.5060327     Document Type: Conference Paper

References (11)

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