Laser microvia drilling and ablation of silicon using 355 nm pico and nanosecond pulses

ICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings

Volumn , Issue , 2008, Pages 278-287

  Pantsar, Henrikki ^a   Herfurth, Hans ^a   Heinemann, Stefan ^a   Laakso, Petri ^b   Penttila, Raimo ^b   Liu, Yi ^c   Newaz, Golam ^c  

^a Fraunhofer USA Inc   (United States)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^c WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABLATION; DEPTH PROFILING; ELECTRIC BREAKDOWN; ELECTRON DIFFRACTION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INFILL DRILLING; LASER ABLATION; PULSE REPETITION RATE; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; ULTRAFAST LASERS;

AMORPHOUS NANOPARTICLES; FEMTOSECOND REGIMES; MATERIAL REMOVAL RATE; MECHANICAL DAMAGES; NANOSECOND PULSED LASER; SCANNING AND TRANSMISSION ELECTRON MICROSCOPY; SELECTED AREA ELECTRON DIFFRACTION PATTERN; VOLUMETRIC MATERIAL;

PULSED LASERS;

EID: 75149190908     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2351/1.5061387     Document Type: Conference Paper

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18. th International Congress on Applications of Lasers and Electro-Optics, Jacksonville, Fl, USA, 1612-1619.
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