Lead-free soldering of telecommunication network infrastructure products

2009 IEEE International Symposium on Sustainable Systems and Technology, ISSST '09 in Cooperation with 2009 IEEE International Symposium on Technology and Society, ISTAS

Volumn , Issue , 2009, Pages

  Eriksson, Bo ^a   Trankell, Richard ^a  

^a NONE

Author keywords

Design for environment; Lead free; Soldering; Telecommunication

Indexed keywords

COMPONENT SELECTION; DESIGN FOR ENVIRONMENT; ERICSSON; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE CONVERSION; LEAD-FREE SOLDERING; POTENTIAL PROBLEMS; PRODUCT DEVELOPMENT PROCESS; PRODUCTION PROCESS; TELECOM NETWORKS;

DESIGN; ELECTRONICS INDUSTRY; PRODUCT DEVELOPMENT; QUALITY ASSURANCE; SOLDERING; TECHNOLOGY; TELECOMMUNICATION; TOTAL QUALITY MANAGEMENT;

LEAD;

EID: 77950974672     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSST.2009.5156736     Document Type: Conference Paper

References (21)

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