Effect of primary creep behavior on fatigue damage accumulation rates in accelerated thermal cycling of Sn3.0Ag0.5Cu Pb-free interconnects

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Cuddalorepatta, Gayatri ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CONSTITUTIVE MODELS; COPPER; COPPER ALLOYS; DAMAGE DETECTION; DEFORMATION; ELECTRONICS INDUSTRY; EXPERIMENTS; FATIGUE DAMAGE; FINITE ELEMENT METHOD; FORECASTING; FORMING; LEAD; LEAD ALLOYS; MICROELECTRONICS; RESIDUAL STRESSES; SOLDERING ALLOYS; STRESS RELAXATION; STRESSES; TESTING; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL; WELDING;

ACCELERATED THERMAL CYCLING; AVERAGE BEHAVIOR; CONSTANT STRESSES; CONSTITUTIVE BEHAVIORS; CREEP BEHAVIORS; CREEP MODELS; CREEP PROPERTIES; CYCLIC FATIGUE; DAMAGE METRICS; DEFORMATION TESTING; FATIGUE DAMAGE ACCUMULATION; FINITE ELEMENT MODEL; FINITE ELEMENT MODELING; INTERNATIONAL CONFERENCES; LARGE GRAINS; MECH ANICAL FATIGUE; MECHANICAL RESPONSES; MICRO-SYSTEMS; MULTI-PHYSICS SIMULATION; PB-FREE; PRIMARY CREEP; SAC SOLDERS; SECONDARY CREEP; SOLDER INTERCONNECTS; STEADY-STATE CREEP; STRESS LEVELS; STRESS RELAXATION BEHAVIOR; STRESS RELAXATION TESTS; STRESS TESTING; TEMPERATURE CYCLING; VISCO-PLASTIC; VISCOPLASTIC RESPONSE;

CREEP;

EID: 49349087347     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525095     Document Type: Conference Paper

References (20)

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