Vibration durability assessment of Sn3.0Ag0.5Cu & Sn37Pb solders under harmonic excitation

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 5, Issue , 2007, Pages 413-420

  Zhou, Yuxun ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; HARMONIC ANALYSIS; MODAL ANALYSIS; NATURAL FREQUENCIES; SOLDERING; SOLDERING ALLOYS; TIME DOMAIN ANALYSIS; TRANSFER FUNCTIONS; VIBRATION ANALYSIS; VIBRATIONS (MECHANICAL);

DURABILITY ASSESSMENT; EXCITATION FREQUENCY; FINITE ELEMENT SIMULATIONS; GENERALIZED STRAINS; HARMONIC EXCITATION; HIGH CYCLE FATIGUE; LOW CYCLE FATIGUES; TIME-DOMAIN APPROACH;

DURABILITY;

EID: 84928593818     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE200743493     Document Type: Conference Paper

References (15)

1. K. Upadhyayula, and A. Dasgupta, "Guidelines for Physics-of-Failure Based Accelerated Stress Test", Reliability and Maintainability Symposium, pp 345-357, 1998
2. Y. Zhou, E. Scanff and A.Dasgupta, "Vibration Durability Comparison of Sn37Pb vs. SnAgCu Solders", Published at ASME International Mechanical Engineering Congress and Exposition, Chicago, IL, Nov, 2006
3. Y. Zhou and A, Dasgupta, "Vibration Durability Investigation for SnPb and SnAgCu Solders with Accelerated Testing and Modeling" Presented at IEEETC7 Conference on Accelerated Stress Tesing & Reliability, San Francisco, CA, October, 2006
4. A. Woodrow, "JCAA/JG-PP No-Lead Solder Project: Vibration Test", Boeing Electronics Materials and Processes Report, 2005
5. Q. Zhang, A. Dasgupta and P. Haswell, "Isothermal Mechanical Durability of Three Selected Pb-free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag and Sn0.7Cu", Transaction of the ASME, Vol. 127, pp 512-522, 2005
6. Nonman E. Dowling, "Mechanical Behavior of Material: Engineering Methods for Deformation, Fracture, and Fatigue" Prentice-Hall, 1999
7. J. Lau, K. Gratalo, and E. Schneider, "Solder Joint Reliability of Large Plastic Ball Grid Aray Assemblies under Bending, Twisting, and Vibration Conditions", Circuit World, Vol. 22, pp. 27-32, 1995
8. J. Lau et al., "Solder joint reliability of surface mount connectors", Journal of Electronic Packaging, Vol. 115, pp. 180-188, 1993
9. J. Lau, E. Schneider, and T. Baker, "Shock and vibration of solder bumped flip chip on organic coated copper boards", Journal of Electronics Packaging, Vol. 118, pp. 101-104, 1996
10. E. Jih and W. Jung, "Vibration Fatigue of Surface Mount Solder Joints", IEEE Inter Society Conference on Thermal Phenomena, pp. 246-250, 1998
11. X. Liu, V. K. Sookala, M. A. Verges and M. C. Larson, "Experimental Study and Life Prediction on High Cycle Vibration Fatigue in BGA packages", Microelectronics Reliability, Vol. 46, pp. 1128-1138, 2006
12. Y. Zhao, C. Basaran, A. Cartwright and T. Dishongh, "Thermomechanical Behavior of BGA Solder Joints under Vibrations: an Experimental Observation", IEEE Inter Society Conference on Thermal Phenomena, pp. 349-355, 2000
13. R. Darveaux and K. Banerji "Constitutive Relations for Tin-Based Solder Joint", IEEE Transactions on Components, Hybrid and Manufacturing Technology, vol. 15, No. 6, pp 1013-1023, 1992
14. Q. Zhang, "Isothermal Mechanical and Thermo-Mechanical Durability Characterization of Selected Pbfree Solders", PHD Thesis, University of Maryland, College Park, MD, 2004
15. P. Haswell, "Durability Assessment and Microstructure Observations of Selected Solder Alloys", PHD Dissertation, University of Maryland, College Park, MD, 2001