Tin whiskers: How to mitigate and manage the risks

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  Mathew, Sony ^a   Osterman, Michael ^a   Shibutani, Tadahiro ^b   Yu, Qiang ^b   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COATINGS; LEAD; RISK MANAGEMENT; SURFACE TREATMENT; TIN ALLOYS;

CONFORMAL COATING; ELECTROPLATING TECHNIQUES;

CRYSTAL WHISKERS;

EID: 41049114844     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283551     Document Type: Conference Paper

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