Effect of Lead-free soldering on key material properties of PR-4 printed circuit board laminates

2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Volumn , Issue , 2008, Pages 195-199

  Sanapala, Ravikumar ^a   Sood, Bhanu ^a   Das, Diganta ^a   Pecht, Michael ^a   Huang, C Y ^b   Tsai, M Y ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY CONDITIONS; BEFORE AND AFTER; COEFFICIENT OF THERMAL EXPANSIONS; CURING AGENTS; DECOMPOSITION TEMPERATURES; DICYANDIAMIDE; GLASS TRANSITION TEMPERATURES; HALOGEN-FREE; HIGHER TEMPERATURES; KEY MATERIALS; LAMINATE MATERIALS; LEAD-FREE SOLDERING; SOLDER ALLOYS; TEST STANDARDS;

BRAZING; ELECTROMAGNETIC WAVE EMISSION; FLAME RETARDANTS; GLASS; GLASS TRANSITION; LAMINATES; LEAD; PACKAGING MATERIALS; PHENOLS; PRINTED CIRCUIT MANUFACTURE; SOLDERING ALLOYS; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMAL EXPANSION; TIN; WATER ABSORPTION; WELDING;

PRINTED CIRCUIT BOARDS;

EID: 64049086780     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2008.4784262     Document Type: Conference Paper

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