Strain range fatigue life assessment of lead-free solder interconnects subject to temperature cycle loading

Soldering and Surface Mount Technology

Volumn 19, Issue 2, 2007, Pages 12-17

  Osterman, Michael ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Fatigue; Modelling; Solder; Temperature measurement

Indexed keywords

ALGORITHMS; CYCLIC LOADS; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; STRAIN; TEMPERATURE MEASUREMENT;

CHIP CARRIERS; FATIGUE LIFE MODEL; MATERIAL MOVEMENT;

SOLDERING;

EID: 34848820604     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910710836494     Document Type: Article

References (13)

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