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Volumn 33, Issue 1, 2007, Pages 5-8

Assessment of risk resulting from unattached tin whisker bridging

Author keywords

Electric breakdown; Electric current; Electronic equipment and components; Risk assessment

Indexed keywords

CONTACT RESISTANCE; CRYSTAL WHISKERS; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTORS; ELECTRIC CURRENTS; NETWORK COMPONENTS;

EID: 33847256499     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120710723652     Document Type: Article
Times cited : (10)

References (10)
  • 1
    • 0038140902 scopus 로고    scopus 로고
    • Tin whisker observations on pure tin-plated ceramic chip capacitors
    • Brusse, J. (2002), “Tin whisker observations on pure tin-plated ceramic chip capacitors”, AESF SUR/FIN Proceedings, June 24-27.
    • (2002) AESF SUR/FIN Proceedings, June 24-27.
    • Brusse, J.1
  • 2
    • 33645136360 scopus 로고    scopus 로고
    • Statistical analysis of tin whisker growth
    • Fang, T., Osterman, M. and Pecht, M. (2006a), “Statistical analysis of tin whisker growth”, Microelectronics Reliability, Vol. 46 Nos 5/6, pp. 846-9.
    • (2006) Microelectronics Reliability , vol.46 , pp. 846-849
    • Fang, T.1    Osterman, M.2    Pecht, M.3
  • 3
    • 33748298817 scopus 로고    scopus 로고
    • Tin whisker risk assessment
    • Fang, T., Osterman, M., Mathew, S. and Pecht, M. (2006b), “Tin whisker risk assessment”, Circuit World, Vol. 32 No. 3, pp. 25-9.
    • (2006) Circuit World , vol.32 , Issue.3 , pp. 25-29
    • Fang, T.1    Osterman, M.2    Mathew, S.3    Pecht, M.4
  • 5
    • 84876898392 scopus 로고    scopus 로고
    • A tin whisker risk assessment algorithm
    • paper presented at the 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, Philadelphia, PA, September 25-29
    • Fang, T., Osterman, M. and Pecht, M. (2005), “A tin whisker risk assessment algorithm”, paper presented at the 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, Philadelphia, PA, September 25-29, pp. 61-5.
    • (2005) , pp. 61-65
    • Fang, T.1    Osterman, M.2    Pecht, M.3
  • 6
    • 33845889089 scopus 로고    scopus 로고
    • Assessing tin whisker risk in electronic products
    • Fang, T., Mathew, S., Osterman, M. and Pecht, M. (2006), “Assessing tin whisker risk in electronic products”, SMT Magazine, Vol. 20 No. 5, pp. 24-5.
    • (2006) SMT Magazine , vol.20 , Issue.5 , pp. 24-25
    • Fang, T.1    Mathew, S.2    Osterman, M.3    Pecht, M.4
  • 7
    • 34047123688 scopus 로고    scopus 로고
    • Tin whiskers: what's the risk?
    • PennWell, Houston, TX, June.
    • Fukuda, Y. and Osterman, M. (2005), “Tin whiskers: what's the risk?”, Lead Free Electronics, PennWell, Houston, TX, June.
    • (2005) Lead Free Electronics
    • Fukuda, Y.1    Osterman, M.2
  • 9
    • 33845704564 scopus 로고    scopus 로고
    • Electrical influence on tin whisker growth
    • Fukuda, Y., Osterman, M. and Pecht, M. (2006a), “Electrical influence on tin whisker growth”, SMT Magazine, Vol. 20 No. 9, pp. 41-2.
    • (2006) SMT Magazine , vol.20 , Issue.9 , pp. 41-42
    • Fukuda, Y.1    Osterman, M.2    Pecht, M.3
  • 10
    • 0032083872 scopus 로고    scopus 로고
    • Spontaneous growth mechanism of tin whiskers
    • Lee, B.Z. and Lee, D.N. (1998), “Spontaneous growth mechanism of tin whiskers”, Acta Materials, Vol. 46 No. 10, pp. 3701-14.
    • (1998) Acta Materials , vol.46 , Issue.10 , pp. 3701-3714
    • Lee, B.Z.1    Lee, D.N.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.