Flex cracking of multilayer ceramic capacitors assembled with Pb-free and tin-lead solders

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 1, 2008, Pages 182-192

  Keimasi, Mohammadreza ^b,c   Azarian, Michael H ^a,b   Pecht, Michael G ^a,b  

^a IEEE

^b UNIVERSITY OF MARYLAND   (United States)

^c DELL INC   (United States)

Author keywords

Capacitors; Ceramic capacitors; Crack detection; Pb free solder; Reliability testing

Indexed keywords

CRACK DETECTION; MULTILAYERS; RELIABILITY ANALYSIS; SOLDERING ALLOYS;

LEAD FREE SOLDERS; MULTILAYER CERAMIC CAPACITORS (MLCCS); RELIABILITY TESTING;

CERAMIC CAPACITORS;

EID: 40549099421     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2007.912256     Document Type: Article

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