SCOPUS 정보 검색 플랫폼

Volumn 81, Issue 3, 2010, Pages

Note: Thermal analog to atomic force microscopy force-displacement measurements for nanoscale interfacial contact resistance

(3) Iverson, Brian D a,b Blendell, John E b Garimella, Suresh V b

a SANDIA NATIONAL LABORATORIES (United States)

b PURDUE UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FORCE-DISPLACEMENT; HEATED ATOMIC FORCE MICROSCOPY; INTERFACIAL CONTACT RESISTANCE; INTERNAL INTERFACES; MEASUREMENT METHODOLOGY; NANO SCALE; ORGANIC THIN FILMS; SI SUBSTRATES; THERMAL CONTRASTS;

ATOMIC FORCE MICROSCOPY; CONTACT RESISTANCE; FILM THICKNESS; HEAT RESISTANCE; SUBSTRATES; THERMAL DIFFUSION IN LIQUIDS; THIN FILMS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 77950570234 PISSN: 00346748 EISSN: None Source Type: Journal
DOI: 10.1063/1.3361157 Document Type: Article

Times cited : (6)

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