Fatigue life and plastic deformation behavior of electrodeposited copper thin films

Materials Science and Engineering: A

Volumn 527, Issue 9, 2010, Pages 2222-2232

  Hwangbo, Yun ^a   Song, Ji Ho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Cyclic plastic strain; Electrodeposited copper film; Fatigue test; Mean stress effect; Ratcheting strain; Tensile test

Indexed keywords

COPPER; CORROSION; ELECTRODEPOSITION; ELECTRODES; FATIGUE TESTING; METALLIC FILMS; PLASTIC DEFORMATION; STRAIN HARDENING; TENSILE STRENGTH; TENSILE TESTING;

COPPER FILMS; CYCLIC PLASTIC STRAIN; ELECTRODEPOSITED COPPER; ELECTRODEPOSITED COPPER FILM; FATIGUE TEST; MEAN STRESS; MEAN STRESS EFFECTS; MONOTONICS; RATCHETING STRAIN; TENSILE TEST;

THIN FILMS;

EID: 76049088768     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.01.016     Document Type: Article

References (36)

1. Ruud A., Josell D., Spaepen F., and Greer A.L. J. Mater. Res. 8 (1993) 112-117
2. Keller R.R., Phelps J.M., and Read D.T. Mater. Sci. Eng. A 214 (1996) 42-52
3. Sharpe Jr. W.N., Yuan B., and Edwards R.L. J. Microelectromech. Syst. 6 (1997) 193-199
4. Ogawa H., Suzuki K., Kaneko S., Nakano Y., Ishikawa Y., and Kitahara T. Microsyst. Technol. (1997) 117-121
5. Huang H., and Spaepen F. Acta Mater. 48 (2000) 3261-3269
6. Read D.T., Cheng Y.W., Keller R.R., and McColskey J.D. Scr. Mater. 45 (2001) 583-589
7. Cheng Y.W., Read D.T., McColskey J.D., and Wright J.E. Thin Solid Films 484 (2005) 426-432
8. Connolley T., Mcchugh P.E., and Bruzzi M. Fatigue Fract. Eng. Mater. Struct. 28 (2005) 1119-1152
9. Luo J.K., Flewitta A.J., Spearing S.M., Fleck N.A., and Milne W.I. Mater. Lett. 58 (2004) 2306-2309
10. Chasiotis I., Bateson C., Timpano K., McCarty A.S., Barker N.S., and Stanec J.R. Thin Solid Films 515 (2007) 3183-3189
11. Klein M., Hadrboletz A., Weiss B., and Khatibi G. Mater. Sci. Eng. A 319-321 (2001) 924-928
12. Haque M.A., and Saif M.T.A. Scr. Mater. 47 (2002) 863-867
13. Son D., Jeong J.H., and Kwon D. Thin Solid Films 437 (2003) 182-187
14. Nilsson S.G., Borrisé X., and Montelius L. Appl. Phys. Lett. 85 (2004) 3555-3557
15. Faurie D., Renault P.O., Le Bourhis E., and Goudeau Ph. Acta Mater. 54 (2006) 4503-4513
16. Angadi M.A., and Thanigaimani V. J. Mater. Sci. Lett. 13 (1994) 703-704
17. Ma D., Xu K., He J., and Lu J. Surf. Coat. Technol. 116-119 (1999) 128-132
18. Oh C.S., Lee H.J., Ko S.G., Kim S.W., and Ahn H.G. Sens. Actuators A 117 (2005) 151-158
19. Kraft O., and Volkert C.A. Adv. Eng. Mater. 3 (2001) 99-110
20. Tsuchiya T., Hirata M., Chiba N., Udo R., Yoshitomi Y., Ando T., Sato K., Takashima K., Higo Y., Saotome Y., Ogawa H., and Ozaki K. J. Microelectromech. Syst. 14 (2005) 1178-1186
21. Hong S., and Weil R. Thin Solid Films 283 (1996) 175-181
22. Read D.T. Int. J. Fatigue 20 (1998) 203-209
23. Kraft O., Schwaiger R., and Wellner P. Mater. Sci. Eng. A 319-321 (2001) 919-923
24. Allameh S.M., Loua J., Kavishe F., Buchheit T., and Soboyejo W.O. Mater. Sci. Eng. A 371 (2004) 256-266
25. Yang Y., Imasogie B.I., Allameh S.M., Boyce B., Lian K., Lou J., and Soboyejo W.O. Mater. Sci. Eng. A 444 (2007) 39
26. Park J.H., Myung M.S., and Kim Y.J. Sens. Actuators A 147 (2008) 561-569
27. Schwaiger R., and Kraft O. Acta Mater. 51 (2003) 195-206
28. Park J.H., An J.H., Kim Y.J., Huh Y.H., and Lee H.J. Materialwiss. Werkstofftech. 39 (2008) 187-192
29. Takashima K., and Higo Y. Fatigue Fract. Eng. Mater. Struct. 28 (2005) 703-710
30. Kim C.Y., Song J.H., and Lee D.Y. Int. J. Fatigue 31 (2009) 736-742
31. Kikukawa M., Jono M., Kondo Y., and Mikami S. Trans. JSME 48 (1982) 1496-1540 (in Japanese)
32. Jono M., and Song J.H. Mater. Res. Ser., Soc. Mater. Sci. Jpn. 1 (1985) 35-55
33. Park J.H., Song J.H., Earmme Y.Y., Kim C.Y., and Kang K.J. Trans. KSME 12 (1988) 123-130 (in Korean)
34. Merchant H.D., Khatibi G., and Weiss B. J. Mater. Sci. 39 (2004) 4157-4170
35. ASM Handbook, vol. 2, Properties & Selection: Nonferrous Alloys and Special Purpose Materials, ASM International, Materials Park, OH, USA, 1990.
36. In: Gad-el-Hak M., et al. (Ed). MEMS Handbook (2005), CRC Press, Boca Raton, FL