Development of a fatigue testing system for thin films

International Journal of Fatigue

Volumn 31, Issue 4, 2009, Pages 736-742

  Kim, Chung Youb ^a   Song, Ji Ho ^b   Lee, Do Young ^b  

^a Chonnam National University   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Displacement gauge; Fatigue testing; Testing machine; Thin films

Indexed keywords

FREQUENCY RESPONSE; GAGES; INSTRUMENTS; LOAD TESTING; MATERIALS TESTING APPARATUS; SOLIDS; STEEL BRIDGES; THIN FILMS;

CAPACITIVE DISPLACEMENTS; CYCLIC DEFORMATIONS; DISPLACEMENT GAUGE; ELECTRODYNAMIC ACTUATORS; FATIGUE BEHAVIORS; HIGH FREQUENCIES; HIGH RESOLUTIONS; LOADING FREQUENCIES; TENSION LOADINGS; TESTING MACHINE; TESTING SYSTEMS;

FATIGUE TESTING;

EID: 58249139906     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijfatigue.2008.03.010     Document Type: Article

References (16)

1. Weihs T.P., Hong S., Bravman J.C., and Nix W.D. Mechanical deflection of cantilever microbeams: a new technique for testing the mechanical properties of thin films. J Mater Res 3 (1988) 931-942
2. Schweitz J.A. Mechanical characterization of thin films by micromechanical techniques. MRS Bull XVII (1992) 34-45
3. Beams J.W. Structure and properties of thin films (1959), Wiley, New York p. 183-92
4. Bromley E.I., Randall J.N., Flanders D.C., and Mountain R.W. A technique for the determination of stress in thin films. J Vac Sci Technol B 1 (1983) 1364-1366
5. Tsuchiya T., Tabata O., Sakata J., and Taga Y. Specimen size effect on tensile strength of surface micromachined polycrystalline silicon thin films. J Microelectromech Syst 7 (1998) 106-113
6. Sharpe W.N., Yuan B., and Edwards R.L. A new technique for measuring the mechanical properties of thin films. J Microelectromech Syst 6 (1997) 193-199
7. Greek S., Ericson F., Johansson S., Furtsch M., and Rump A. Micro characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructure. J Micromech Microeng 9 (1999) 245-251
8. Sharpe W.N., and Turner K.T. Fatigue testing of materials used in microelectromechanical systems. In: Wu X.R., and Wang Z.G. (Eds). Fatigue vol. 99 (1999), EMAS, UK 1837-1844
9. Bagdahn J., and Sharpe W.N. Fatigue of polycrystalline silicon under long term cyclic loading. Sens Actuators A 103 (2003) 9-15
10. Judelewicz M., Kiinzi H.U., Merk N., and Ilschner B. Microstructural development during fatigue of copper foils 20-100 μm thick. Mater Sci Eng A 186 (1994) 135-142
11. Hong S., and Weil R. Low cycle fatigue of thin copper foils. Thin Solid Films 283 (1996) 175-181
12. Read D.T. Tension-tension fatigue of copper thin films. Int J Fatigue 20 (1998) 203-209
13. Muhlstein C., Brown S., and Ritchie R.O. High-cycle fatigue of single crystal silicon thin films. J Microelectromech Syst 10 (2001) 593-600
14. Kahn H., Ballarini R., Mullen R.L., and Heuer A.H. Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens. Proc R Soc London 455 (1999) 3807-3823
15. Moore A.J., and Tyrer J.R. Two dimensional strain measurement with ESPI. Opt Laser Eng 24 (1996) 381-402
16. E466-96. Annual book of ASTM standards, vol. 03.01. Philadelphia (PA): ASTM; 2000. p. 419.