Temperature-dependent thermal conductivities of CMOS layers by micromachined thermal van der Pauw test structures

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 246-252

  Hafizovic, S ^a   Paul, O ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Sheet resistance; Test structure; Thermal conductivity; Thin film; Van der Pauw method

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; HEAT RESISTANCE; MICROMACHINING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON NITRIDE; THERMAL CONDUCTIVITY; THIN FILMS;

THERMAL SHEET RESISTANCE; THERMAL TEST STRUCTURES; VAN DER PAUW METHOD;

MICROELECTROMECHANICAL DEVICES;

EID: 0036544236     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00864-0     Document Type: Conference Paper

References (16)

1. Micromachined, thermally based CMOS microsensors
2. Methods for the measurement of therma conductivity and thermal diffusivity of very thin films and foils
3. 4 sandwich system
4. A microstructure for measurement of thermal conductivity of polysilicon thin films
5. Process-dependent thin-film thermal conductivities for thermal CMOS MEMS
6. Thermal diffusivity of heavily doped low pressure chemical vapor deposited polycrystalline silicon films
7. Thermal conductivity of thin silicon dioxide films in integrated circuits
8. 2 films
9. Thermal conductivity of doped polysilicon layers
10. A thermal van der Pauw test structure
11. A method of measuring specific resistivity and Hall effect of disc of arbitrary shape
12. Process-dependent thermophysical properties of CMOS IC thin films
13. Micromachined hot-plate test structure to measure the heat capacity of CMOS IC thin films
14. Annealing-temperature dependence of the thermal conductivity of LPCVD silicon-dioxide layers
15. Thermophysical properties of low-residual stress, silicon-rich, LPCVD silicon nitride films