An online test microstructure for thermal conductivity of surface-micromachined polysilicon thin films

IEEE Sensors Journal

Volumn 6, Issue 2, 2006, Pages 428-432

  Xu, Gao Bin ^b   Huang, Qing An ^a,b,c  

^a IEEE   (China)

^b Southeast University   (China)

^c SOUTHEAST UNIVERSITY   (China)

Author keywords

Online test; Polysilicon thin films; Surface micromachining process; Thermal conductivity

Indexed keywords

ANSYS SOFTWARE; ELECTROTHERMAL MODEL; ONLINE TEST; POLYSILICON THIN FILMS; SHEET RESISTANCE; SURFACE-MICROMACHINING PROCESS;

DOPING (ADDITIVES); ELECTRIC RESISTANCE; HEAT CONVECTION; HEAT LOSSES; HEAT TRANSFER; MICROMACHINING; MICROSTRUCTURE; POLYSILICON; RADIATION; SUBSTRATES; VOLTAGE MEASUREMENT;

THIN FILMS;

EID: 33645165825     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2006.870169     Document Type: Article

References (16)

1. E. Obermerier and P. Kopystynsk, "Polysilicon as a material for microsensor applications," Sens. Actuators A, vol. 30, pp. 149-155, 1992.
2. J. M. Bustillo, R. T. Howe, and R. S. Muller, "Surface micromachining for microelectromechanical systems," Proc. IEEE, vol. 86, no. 8, pp. 1552-1574, Aug. 1998.
3. M. von. Arx, O. Paul, and H. Baltes, "Process dependent thin film thermal conductivities for thermal CMOS MEMS," J. Microelectromech. Syst., vol. 3, pp. 136-144, 2000.
4. A. D. McConnell, S. Uma, and K. E. Goodson, "Thermal conductivity of doped polysilicon layers," J. Microelectromech. Syst., vol. 10, no. 3, pp. 360-369, 2001.
5. E. Jansen and E. Obermeier, "Thermal conductivity measurements on thin films based on micromechanical devices," J. Microelectromech. Syst., vol. 6, no. 3, pp. 118-121, 1996.
6. F. Volkein and H. Baltes, "A microstructure for measurement of thermal conductivity of polysilicon thin films," J. Microelectromech. Syst., vol. 1, no. 4, pp. 193-196, 1992.
7. A. Irace and P. M. Sarro, "Measurement of thermal conductivity and diffusivity of single and multiplayer membranes," Sens. Actuators A, vol. 76, pp. 323-328, 1999.
8. S. Hafizovic and O. Paul, "Temperature-dependent thermal conductivities of CMOS layers by micromachined thermal van der Pauw test structures," Sensors and Actuators A, vol. 97-98, pp. 246-252, 2002.
9. O. Paul, P. Ruther, L. Plattner, and H. Baltes, "A thermal van der Pauw test structure," IEEE Trans. Semicond. Manufact., vol. 13, no. 2, pp. 159-166, May 2000.
10. Y. C. Tai, C. H. Mastrengelo, and R. S. Muller, "Thermal conductivity of heavily doped low-pressure chemical vapor deposited polycrystalline silicon films," J. Appl. Phys., vol. 63, no. 5, pp. 1442-1447, 1988.
11. A. A. Geisberger, N. Sarkar, and G. D. Skidmore, "Electrothermal properties and modeling of polysilicon microthermal actuators," J. Microelectromech. Syst., vol. 12, no. 4, pp. 513-523, 2003.
12. D. G. Cahill, "Thermal conductivity measurement from 30 to 750 K: The 3ω method," Rev. Sci. Instrum., vol. 61, no. 2, pp. 802-808, 1990.
13. Q. A. Huang and N. K. S. Lee, "Analysis and design of polysilicon thermal flexure actuator," J. Micromech. Microeng, vol. 9, pp. 64-70, 1999.
14. L. W. Lin and M. Chiao, "Electrothermal responses of lineshape microstructures," Sens. Actuators, vol. 55, pp. 35-41, 1996.
15. G. B. Xu and Q. A. Huang, "On-line extraction for thermal conductivity of surface-micromachined polysilicon thin films," in Proc. 3rd IEEE Sensors Conf., 2004, pp. 430-435.
16. I. Leon, R. Amador, and K. Kohlhof, "Evaluation of MUMPS polysilicon structures for thermal flow sensors," Microelectron. Rel., vol. 44, pp. 651-655, 2004.