Post processing of microstructures by PDMS spray deposition

Sensors and Actuators, A: Physical

Volumn 155, Issue 2, 2009, Pages 253-262

  Choonee, K ^a   Syms, R R A ^a   Ahmad, M M ^a   Zou, H ^b  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Embossing; PDMS; Soft lithography; Spray deposition; Wafer bonding

Indexed keywords

ADHESION LAYER; ALKANETHIOLS; COATING PROCESS; CONFORMAL COVERAGE; DOW CORNING; FILM QUALITY; GAS PRESSURES; MICRO CONTACT PRINTING; MICROFABRICATED; MICROFLUIDIC CHANNEL; MICRON SCALE; OPTICAL PROFILOMETRY; PDMS; PLASMA-ACTIVATED BONDINGS; POLYDIMETHYLSILOXANE PDMS; POST PROCESSING; PROCESS PARAMETERS; ROTATING SUBSTRATES; SI WAFER; SOFT LITHOGRAPHY; SPRAY COATING; SPRAY DEPOSITION;

BONDING; COATINGS; DEPOSITS; HEXANE; LITHOGRAPHY; MICROCHANNELS; MICROSTRUCTURE; NANOIMPRINT LITHOGRAPHY; PHOTORESISTS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SILICONES; SUBSTRATES; SURFACE ROUGHNESS;

WAFER BONDING;

EID: 71749101034     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.08.029     Document Type: Article

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