Using polydimethylsiloxane as a thermocurable resist for a soft imprint lithography process

Microelectronic Engineering

Volumn 61-62, Issue , 2002, Pages 379-384

  Malaquin, L ^a   Carcenac, F ^a   Vieu, C ^a   Mauzac, M ^b  

^a LAAS CNRS   (France)

^b UMR 5623 CNRS UPS)   (France)

Author keywords

Electron beam lithography; High resolution; Mold; Nanoimprint lithography; PDMS; PMMA

Indexed keywords

ELASTOMERS; NANOTECHNOLOGY; POLYMETHYL METHACRYLATES; PRESSURE EFFECTS; REACTIVE ION ETCHING; SILICON; THERMAL EFFECTS;

NANOIMPRINT LITHOGRAPHY (NIL);

ELECTRON BEAM LITHOGRAPHY;

EID: 0036643583     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00573-7     Document Type: Conference Paper

References (5)