메뉴 건너뛰기




Volumn , Issue , 2009, Pages 523-530

Accurate model for time-dependent dielectric breakdown of high-k metal gate stacks

Author keywords

Breakdown statistics; High K; TDDB

Indexed keywords

BIMODAL DISTRIBUTION; BREAKDOWN STATISTICS; DEFECT GENERATION; DIELECTRIC STACK; HIGH-K; INITIAL DEFECTS; METAL GATE STACK; PERCOLATION MODELS; TDDB; TIME-DEPENDENT DIELECTRIC BREAKDOWN; WEIBULL SLOPE;

EID: 70449119900     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IRPS.2009.5173307     Document Type: Conference Paper
Times cited : (121)

References (18)
  • 1
    • 36448954531 scopus 로고    scopus 로고
    • Band-Edge High-Performance High-k/Metal Gate n-MOSFETs Using Cap Layers Containing Group IIA and IIIB Elements with Gate-First Processing for 45 nm and Beyond
    • V. Narayanan, et al., "Band-Edge High-Performance High-k/Metal Gate n-MOSFETs Using Cap Layers Containing Group IIA and IIIB Elements with Gate-First Processing for 45 nm and Beyond" Symposium on VLSI Technology, pp.178-179,2006.
    • (2006) Symposium on VLSI Technology , pp. 178-179
    • Narayanan, V.1
  • 2
    • 50249185641 scopus 로고    scopus 로고
    • A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging
    • K. Mistry, et al., "A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging", International Electron Device Meeting, pp. 247-250, 2007.
    • (2007) International Electron Device Meeting , pp. 247-250
    • Mistry, K.1
  • 3
    • 64549083594 scopus 로고    scopus 로고
    • Breakdown in the Metal/High-k gate stack: Identifying the "weak link" in the multilayer dielectric
    • G. Bersuker, et al., "Breakdown in the Metal/High-k gate stack: Identifying the "weak link" in the multilayer dielectric", International Electron Device Meeting, pp. 791-794, 2008.
    • (2008) International Electron Device Meeting , pp. 791-794
    • Bersuker, G.1
  • 4
    • 0033314629 scopus 로고    scopus 로고
    • Analysis of high voltage TDDB measurements in Ta2O5/SiO2 stack
    • R. Degraeve, et al., "Analysis of high voltage TDDB measurements in Ta2O5/SiO2 stack", International Electron Device Meeting, pp. 327-330, 1999.
    • (1999) International Electron Device Meeting , pp. 327-330
    • Degraeve, R.1
  • 6
    • 67650443125 scopus 로고    scopus 로고
    • TDDB failure distribution of metal gate / high-k CMOS devices on SOI substrates
    • to be published
    • A. Kerber et al., "TDDB failure distribution of metal gate / high-k CMOS devices on SOI substrates", Int. Rel. Phys. Symp. Proc, to be published, 2009.
    • (2009) Int. Rel. Phys. Symp. Proc
    • Kerber, A.1
  • 7
    • 67650332617 scopus 로고    scopus 로고
    • 2/TiN gate stacks during positive bias temperature stress
    • to be published
    • 2/TiN gate stacks during positive bias temperature stress", Int. Rel. Phys. Symp. Proc, to be published, 2009.
    • (2009) Int. Rel. Phys. Symp. Proc
    • Cartier, E.1    Kerber, A.2
  • 9
    • 0008536196 scopus 로고    scopus 로고
    • New Insights in the Relation Between Electron Trap Generation and the Statistical Properties of Oxide Breakdown
    • R. Degraeve et al., "New Insights in the Relation Between Electron Trap Generation and the Statistical Properties of Oxide Breakdown", IEEE Transactions On Electron Devices, Vol. 45, No. 4, p904, 1998.
    • (1998) IEEE Transactions On Electron Devices , vol.45 , Issue.4 , pp. 904
    • Degraeve, R.1
  • 11
    • 0035362378 scopus 로고    scopus 로고
    • New Physics-Based Analytic Approach to the Thin-Oxide Breakdown Statistics
    • J. Suñé, "New Physics-Based Analytic Approach to the Thin-Oxide Breakdown Statistics", IEEE Electron Device Letters, Vol. 22, No. 6, p296, 2001.
    • (2001) IEEE Electron Device Letters , vol.22 , Issue.6 , pp. 296
    • Suñé, J.1
  • 12
    • 34548744634 scopus 로고    scopus 로고
    • Analytic Extension of the Cell-based Oxide Breakdown Model to full Percolation and it Implications
    • pp
    • A. Krishnan and P. Nicollian,"Analytic Extension of the Cell-based Oxide Breakdown Model to full Percolation and it Implications", pp. 232, International Reliability Physics Symposium 2006.
    • (2006) International Reliability Physics Symposium , pp. 232
    • Krishnan, A.1    Nicollian, P.2
  • 13
    • 64549163613 scopus 로고    scopus 로고
    • TDDB in the presence of Interface states: Implication for the PMOS reliability margin
    • T. Nigam and P. Peumans, "TDDB in the presence of Interface states: Implication for the PMOS reliability margin", International Electron Device Meeting, pp. 783-786, 2008.
    • (2008) International Electron Device Meeting , pp. 783-786
    • Nigam, T.1    Peumans, P.2
  • 15
    • 31044455312 scopus 로고    scopus 로고
    • High dielectric constant gate oxides for metal oxide Si transistors
    • pp.327-396
    • J. Robertson, "High dielectric constant gate oxides for metal oxide Si transistors", Reports on Progress in Physics, 69, pp.327-396, 2006.
    • (2006) Reports on Progress in Physics , pp. 69
    • Robertson, J.1
  • 17
    • 64549147008 scopus 로고    scopus 로고
    • Trap spectroscopy by change injection and sensing (TSICS): A quatitative electrical technique for studying defects in dielectric stacks
    • R. Degraeve et al., "Trap spectroscopy by change injection and sensing (TSICS): A quatitative electrical technique for studying defects in dielectric stacks", International Electron Device Meeting, pp. 775-778, 2008
    • (2008) International Electron Device Meeting , pp. 775-778
    • Degraeve, R.1
  • 18
    • 0036045181 scopus 로고    scopus 로고
    • Strong Correlation between Dielectric Reliability and Charge Trapping in SiO2 / Al2O3 Gate Stacks with TiN Electrodes
    • A. Kerber, et al., "Strong Correlation between Dielectric Reliability and Charge Trapping in SiO2 / Al2O3 Gate Stacks with TiN Electrodes", VLSI, pp. 76-77, 2002.
    • (2002) VLSI , pp. 76-77
    • Kerber, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.