SCOPUS 정보 검색 플랫폼

Journal of the Electrochemical Society

Volumn 156, Issue 12, 2009, Pages

Formation of 100 μm Deep vertical pores in Si wafers by wet etching and Cu electrodeposition

(5) Lee, Chia Lung a Tsuru, Shinsuke a Kanda, Yuji a Ikeda, Shigeru a Matsumura, Michio a

a OSAKA UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AG/AGCL; AQUEOUS SOLUTIONS; AU PARTICLES; CU DEPOSITION; ELECTROCATALYTIC EFFECTS; PORE FORMATION; SI SURFACES; SI WAFER; SI(1 0 0); SIMPLE METHOD;

AGGLOMERATION; CATALYSTS; COPPER PLATING; ELECTROCATALYSIS; ELECTRODEPOSITION; SEMICONDUCTING SILICON COMPOUNDS; SILICON; WET ETCHING;

SILICON WAFERS;

EID: 70350742937 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3237139 Document Type: Article

Times cited : (16)

References (26)

1
- 0023310725
- DESIGN CONSIDERATIONS FOR A PRACTICAL ELECTROSTATIC MICRO-MOTOR.
- DOI 10.1016/0250-6874(87)80016-1
- W. S. N. Trimmer and K. J. Gabriel, Sens. Actuators 0250-6874, 11, 189 (1987). 10.1016/0250-6874(87)80016-1 (Pubitemid 17569749)
- (1987) Sensors and actuators , vol.11 , Issue.2 , pp. 189-206
- Trimmer, W.S.N.¹ Gabriel, K.J.²

2
- 0030435042
- 0043-1648 10.1016/S0043-1648(96)07328-0
- K. Komvopoulos, Wear 0043-1648, 200, 305 (1996). 10.1016/S0043-1648(96) 07328-0
- (1996) Wear , vol.200 , pp. 305
- Komvopoulos, K.¹

3
- 0035689377
- Microelectromechanical systems (MEMS): Fabrication, design and applications
- DOI 10.1088/0964-1726/10/6/301, PII S0964172601296566
- J. W. Judy, Smart Mater. Struct. 0964-1726, 10, 1115 (2001). 10.1088/0964-1726/10/6/301 (Pubitemid 34050629)
- (2001) Smart Materials and Structures , vol.10 , Issue.6 , pp. 1115-1134
- Judy, J.W.¹

4
- 38849136535
- Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging
- DOI 10.1016/j.sna.2007.02.030, PII S092442470700101X
- F. Ji, S. Leppävuori, I. Luusua, K. Henttinen, S. Eränen, I. Hietanen, and M. Juntunen, Sens. Actuators, A 0924-4247, 142, 405 (2008). 10.1016/j.sna.2007.02.030 (Pubitemid 351199554)
- (2008) Sensors and Actuators, A: Physical , vol.142 , Issue.1 , pp. 405-412
- Ji, F.¹ Leppavuori, S.² Luusua, I.³ Henttinen, K.⁴ Eranen, S.⁵ Hietanen, I.⁶ Juntunen, M.⁷

5
- 31044437398
- Process integration for through-silicon vias
- DOI 10.1116/1.1864012
- S. Spiesshoefer, Z. Rahman, G. Vangara, S. Polamreddy, S. Burkett, and L. Schaper, J. Vac. Sci. Technol. A 0734-2101, 23, 824 (2005). 10.1116/1.1864012 (Pubitemid 43119211)
- (2005) Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films , vol.23 , Issue.4 , pp. 824-829
- Spiesshoefer, S.¹ Rahman, Z.² Vangara, G.³ Polamreddy, S.⁴ Burkett, S.⁵ Schaper, L.⁶

6
- 33749320317
- Back side exposure of variable size through silicon vias
- DOI 10.1116/1.2221313
- T. Rowbotham, J. Patel, T. Lam, I. U. Abhulimen, S. Burkett, L. Cai, and L. Schaper, J. Vac. Sci. Technol. B 1071-1023, 24, 2460 (2006). 10.1116/1.2221313 (Pubitemid 44496242)
- (2006) Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures , vol.24 , Issue.5 , pp. 2460-2466
- Rowbotham, T.¹ Patel, J.² Lam, T.³ Abhulimen, I.U.⁴ Burkett, S.⁵ Cai, L.⁶ Schaper, L.⁷

7
- 0242303135
- 1521-3323 10.1109/TADVP.2003.818060
- S. J. Ok, C. Kim, and D. F. Baldwin, IEEE Trans. Adv. Packag. 1521-3323, 26, 302 (2003). 10.1109/TADVP.2003.818060
- (2003) IEEE Trans. Adv. Packag. , vol.26 , pp. 302
- Ok, S.J.¹ Kim, C.² Baldwin, D.F.³

8
- 24644495782
- Three-dimensional system-in-package using stacked silicon platform technology
- DOI 10.1109/TADVP.2005.852895
- V. Kripesh, S. W. Yoon, V. P. Ganesh, N. Khan, M. D. Rotaru, F. Wang, and M. K. Iyer, IEEE Trans. Adv. Packag. 1521-3323, 28, 377 (2005). 10.1109/TADVP.2005.852895 (Pubitemid 41263743)
- (2005) IEEE Transactions on Advanced Packaging , vol.28 , Issue.3 , pp. 377-386
- Kripesh, V.¹ Yoon, S.W.² Ganesh, V.P.³ Khan, N.⁴ Rotaru, M.D.⁵ Fang, W.⁶ Iyer, M.K.⁷

9
- 33646934683
- New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration
- DOI 10.1143/JJAP.45.3030
- T. Fukushima, Y. Yamada, H. Kikuchi, and M. Koyanagi, Jpn. J. Appl. Phys., Part 1 0021-4922, 45, 3030 (2006). 10.1143/JJAP.45.3030 (Pubitemid 43794136)
- (2006) Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers , vol.45 , Issue.4 B , pp. 3030-3035
- Fukushima, T.¹ Yamada, Y.² Kikuchi, H.³ Koyanagi, M.⁴

10
- 44449086461
- New 3-D chip stacking architectures by wire-on-bump and bump-on-flex
- DOI 10.1109/TADVP.2007.909454
- B. -W. Lee, J. -Y. Tsai, H. Jin, C. K. Yoon, and R. R. Tummala, IEEE Trans. Adv. Packag. 1521-3323, 31, 367 (2008). 10.1109/TADVP.2007.909454 (Pubitemid 351761588)
- (2008) IEEE Transactions on Advanced Packaging , vol.31 , Issue.2 , pp. 367-376
- Lee, B.-W.¹ Tsai, J.-Y.² Jin, H.³ Yoon, C.K.⁴ Tummala, R.R.⁵

11
- 0027848479
- 0163-1918.
- J. Paraszczak, D. Edelstein, S. Cohen, E. Babich, and J. Hummel, Tech. Dig.-Int. Electron Devices Meet. 0163-1918, 1993, 261.
- Tech. Dig. - Int. Electron Devices Meet. , vol.1993 , pp. 261
- Paraszczak, J.¹ Edelstein, D.² Cohen, S.³ Babich, E.⁴ Hummel, J.⁵

12
- 0032166781
- 0018-8646.
- P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev. 0018-8646, 42, 567 (1998).
- (1998) IBM J. Res. Dev. , vol.42 , pp. 567
- Andricacos, P.C.¹ Uzoh, C.² Dukovic, J.O.³ Horkans, J.⁴ Deligianni, H.⁵

13
- 0038469897
- Advanced copper electroplating for application of electronics
- DOI 10.1016/S0257-8972(03)00165-8, PII S0257897203001658
- S. Miura and H. Honma, Surf. Coat. Technol. 0257-8972, 169-170, 91 (2003). 10.1016/S0257-8972(03)00165-8 (Pubitemid 36704806)
- (2003) Surface and Coatings Technology , vol.169-170 , pp. 91-95
- Miura, S.¹ Honma, H.²

14
- 27944494863
- 0013-4651 10.1149/1.2052019
- W. -P. Dow, M. -Y. Yen, W. -B. Lin, and S. -W. Ho, J. Electrochem. Soc. 0013-4651, 152, C769 (2005). 10.1149/1.2052019
- (2005) J. Electrochem. Soc. , vol.152 , pp. 769
- Dow, W.-P.¹ Yen, M.-Y.² Lin, W.-B.³ Ho, S.-W.⁴

15
- 13844256568
- 0018-8646.
- P. M. Vereecken, R. A. Binstead, H. Deligianni, and P. C. Andricacos, IBM J. Res. Dev. 0018-8646, 49, 1 (2005).
- (2005) IBM J. Res. Dev. , vol.49 , pp. 1
- Vereecken, P.M.¹ Binstead, R.A.² Deligianni, H.³ Andricacos, P.C.⁴

16
- 33845269528
- Deep silicon macropores filled with copper by electrodeposition
- DOI 10.1149/1.2393090
- C. Fang, E. Foca, S. Xu, J. Carstensen, and H. Föll, J. Electrochem. Soc. 0013-4651, 154, D45 (2007). 10.1149/1.2393090 (Pubitemid 44866327)
- (2007) Journal of the Electrochemical Society , vol.154 , Issue.1
- Fang, C.¹ Foca, E.² Xu, S.³ Carstensen, J.⁴ Foll, H.⁵

17
- 2042442448
- 0013-4651 10.1149/1.1649235
- K. Kondo, T. Matsumoto, and K. Watanabe, J. Electrochem. Soc. 0013-4651, 151, 250 (2004). 10.1149/1.1649235
- (2004) J. Electrochem. Soc. , vol.151 , pp. 250
- Kondo, K.¹ Matsumoto, T.² Watanabe, K.³

18
- 39349109659
- Pore formation in silicon by wet etching using micrometre-sized metal particles as catalysts
- DOI 10.1039/b715639a
- C. -L. Lee, K. Tsujino, Y. Kanda, S. Ikeda, and M. Matsumura, J. Mater. Chem. 0959-9428, 18, 1015 (2008). 10.1039/b715639a (Pubitemid 351264722)
- (2008) Journal of Materials Chemistry , vol.18 , Issue.9 , pp. 1015-1020
- Lee, C.-L.¹ Tsujino, K.² Kanda, Y.³ Ikeda, S.⁴ Matsumura, M.⁵

19
- 34548559714
- 2 at different concentrations using silver nanoparticles as catalysts
- DOI 10.1016/j.electacta.2007.01.035, PII S0013468607001211, Electrochemical Processing of Tailored Materials, Selection of papers from the 4th International Symposium (EPTM 2005) 3-5 October 2005, Kyoto, Japan
- K. Tsujino and M. Matsumura, Electrochim. Acta 0013-4686, 53, 28 (2007). 10.1016/j.electacta.2007.01.035 (Pubitemid 47391451)
- (2007) Electrochimica Acta , vol.53 , Issue.1 , pp. 28-34
- Tsujino, K.¹ Matsumura, M.²

20
- 17844363741
- Boring deep cylindrical nanoholes in silicon using silver nanoparticles as a catalyst
- DOI 10.1002/adma.200401681
- K. Tsujino and M. Matsumura, Adv. Mater. (Weinheim, Ger.) 0935-9648, 17, 1045 (2005). 10.1002/adma.200401681 (Pubitemid 40584346)
- (2005) Advanced Materials , vol.17 , Issue.8 , pp. 1045-1047
- Tsujino, K.¹ Matsumura, M.²

21
- 28044446333
- 1099-0062 10.1149/1.2109347
- K. Tsujino and M. Matsumura, Electrochem. Solid-State Lett. 1099-0062, 8, C193 (2005). 10.1149/1.2109347
- (2005) Electrochem. Solid-State Lett. , vol.8 , pp. 193
- Tsujino, K.¹ Matsumura, M.²

22
- 38649113564
- 1388-2481 10.1016/j.elecom.2007.12.021
- Y. L. Kawamura, K. Fukami, T. Sakka, and Y. H. Ogata, Electrochem. Commun. 1388-2481, 10, 346 (2008). 10.1016/j.elecom.2007.12.021
- (2008) Electrochem. Commun. , vol.10 , pp. 346
- Kawamura, Y.L.¹ Fukami, K.² Sakka, T.³ Ogata, Y.H.⁴

23
- 42949155133
- Self-selective electroless plating: An approach for fabrication of functional 1D nanomaterials
- DOI 10.1016/j.mser.2008.03.001, PII S0927796X08000284
- T. Qiu and P. K. Chu, Mater. Sci. Eng. R. 0927-796X, 61, 59 (2008). 10.1016/j.mser.2008.03.001 (Pubitemid 351608555)
- (2008) Materials Science and Engineering R: Reports , vol.61 , Issue.1-6 , pp. 59-77
- Qiu, T.¹ Chu, P.K.²

24
- 2942616585
- 0013-4651 10.1149/1.1669026
- N. Mitsugi and K. Nagai, J. Electrochem. Soc. 0013-4651, 151, G302 (2004). 10.1149/1.1669026
- (2004) J. Electrochem. Soc. , vol.151 , pp. 302
- Mitsugi, N.¹ Nagai, K.²

25
- 58049133275
- 0013-4651 10.1149/1.3033735
- C. -L. Lee, Y. Kanda, T. Hirai, S. Ikeda, and M. Matsumura, J. Electrochem. Soc. 0013-4651, 156, H134 (2009). 10.1149/1.3033735
- (2009) J. Electrochem. Soc. , vol.156 , pp. 134
- Lee, C.-L.¹ Kanda, Y.² Hirai, T.³ Ikeda, S.⁴ Matsumura, M.⁵

26
- 58349119566
- 0169-4332 10.1016/j.apsusc.2008.12.020
- S. Yae, T. Hirano, T. Matsuda, N. Fukumuro, and H. Matsuda, Appl. Surf. Sci. 0169-4332, 255, 4670 (2009). 10.1016/j.apsusc.2008.12.020
- (2009) Appl. Surf. Sci. , vol.255 , pp. 4670
- Yae, S.¹ Hirano, T.² Matsuda, T.³ Fukumuro, N.⁴ Matsuda, H.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.