New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 4 B, 2006, Pages 3030-3035

  Fukushima, Takafumi ^a   Yamada, Yusuke ^a   Kikuchi, Hirokazu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Adhesive injection; Chemical mechanical polishing; Chip alignment; Chip to wafer bonding; Deep Si etching; Known good dies; Super chip integration; Three dimensional integration technology

Indexed keywords

BONDING; CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; ETCHING; INTEGRATED CIRCUITS; POLYCRYSTALLINE MATERIALS; SILICON WAFERS;

CHIP ALIGNMENT; CHIP-TO-WAFER BONDING; DEEP SI ETCHING; THREE-DIMENSIONAL INTEGRATION TECHNOLOGY;

MICROPROCESSOR CHIPS;

EID: 33646934683     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.3030     Document Type: Article

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