Dry etching of polydimethylsiloxane using microwave plasma

Journal of Micromechanics and Microengineering

Volumn 19, Issue 9, 2009, Pages

  Hwang, Sung Jin ^a   Oh, Dong Joon ^a   Jung, Phill Gu ^a   Lee, Sang Min ^a   Go, Jeung Sang ^a   Kim, Joon Ho ^b   Hwang, Kyu Youn ^b   Ko, Jong Soo ^a  

^a Pusan National University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAY-TYPE; ETCH RATES; ETCHING METHOD; FLUX RATIO; GAS FLUX; MICROPROTRUSIONS; MICROWAVE PLASMA; MICROWAVE POWER; MICROWELLS; PDMS SURFACES; POLYDIMETHYLSILOXANE PDMS; POTENTIAL APPLICATIONS; SUPERHYDROPHOBIC; TETRAFLUOROMETHANE;

CONTACT ANGLE; DRY ETCHING; MICROCHANNELS; MICROSTRUCTURE; MICROWAVE GENERATION; MICROWAVE POWER TRANSMISSION; OXYGEN; PLASMA ETCHING;

SILICONES;

EID: 70350635564     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/9/095010     Document Type: Article

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