Thick single-layer positive photoresist mold and poly(dimethylsiloxane) (PDMS) dry etching for the fabrication of a glass-PDMS-glass microfluidic device

Journal of Micromechanics and Microengineering

Volumn 18, Issue 11, 2008, Pages

  Oh, S R ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FLUIDIC DEVICES; GLASS; MICROCHANNELS; MOLDS; OXYGEN; PHOTORESISTORS; PHOTORESISTS; PLASMA ETCHING; POLYMERS; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICONES; SURFACE TREATMENT; TURBULENT FLOW;

BONDING ABILITIES; BONDING STRENGTHS; DIMETHYLSILOXANE; GLASS MICROFLUIDIC DEVICES; LEAK FREE; LIFTOFF TECHNIQUES; LOW COSTS; MICROFABRICATION TECHNIQUES; MICROFLUIDIC CHANNELS; MICROFLUIDIC DEVICES; MICROFLUIDIC STRUCTURES; MOLDABILITY; NEGATIVE PHOTORESISTS; NOVOLAK; OXYGEN PLASMAS; PHOTORESIST MOLDS; REACTIVE IONS; SACRIFICIAL MOLDS; SCANNING ELECTRON MICROSCOPES; SIDE-WALLS; SINGLE LAYERS; UNIFORM THICKNESSES;

GLASS BONDING;

EID: 58149347087     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/11/115025     Document Type: Article

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