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Volumn 19, Issue 8, 2009, Pages

A microcasted PDMS vacuum pad and its application for stacking thin ceramic layers

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC LAYER; GREEN SHEETS; METAL MOLD; MICRO HOLES; MICROCASTING; MICROMACHINING PROCESS; MULTI-LAYER CERAMIC CAPACITOR; NICKEL ELECTRODE; PRODUCTION YIELD; THICK DIELECTRICS; TWO STAGE; VACUUM LINE;

EID: 70350670525     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/8/085008     Document Type: Article
Times cited : (2)

References (30)
  • 1
    • 0030149777 scopus 로고    scopus 로고
    • Developments in mobile/portable telephones and key devices for miniaturization
    • Urabe S and Nojima T 1996 Developments in mobile/portable telephones and key devices for miniaturization IEICE Trans. Electron. E79-C 600-5
    • (1996) IEICE Trans. Electron. , vol.79-100 , Issue.5 , pp. 600-605
    • Urabe, S.1    Nojima, T.2
  • 2
    • 0038343573 scopus 로고    scopus 로고
    • Base-metal electrode-multilayer ceramic capacitors: Past, present and future perspectives
    • Kishi H, Mizuno Y and Chazono H 2003 Base-metal electrode-multilayer ceramic capacitors: past, present and future perspectives Japan. J. Appl. Phys. 42 1-15
    • (2003) Japan. J. Appl. Phys. , vol.42 , Issue.PART 1 , pp. 1-15
    • Kishi, H.1    Mizuno, Y.2    Chazono, H.3
  • 4
    • 22544470909 scopus 로고    scopus 로고
    • Materials for inductive and microwave function integration in LTCC-technology multichip modules
    • Zaspalis V T Z, Kolenbrander M and Boerekamp J 2005 Materials for inductive and microwave function integration in LTCC-technology multichip modules J. Phys.: Conf. Ser. 10 357-60
    • (2005) J. Phys.: Conf. Ser. , vol.10 , pp. 357-360
    • Zaspalis, V.T.Z.1    Kolenbrander, M.2    Boerekamp, J.3
  • 5
    • 4544261833 scopus 로고    scopus 로고
    • Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications
    • Chung G S and Kim J M 2004 Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications Sensors Actuators A 116 352-6
    • (2004) Sensors Actuators , vol.116 , Issue.2 , pp. 352-356
    • Chung, G.S.1    Kim, J.M.2
  • 6
    • 0037012557 scopus 로고    scopus 로고
    • Barium titanate glass-ceramic thin films for integrated high-dielectric media
    • Yao K and Zhu W 2002 Barium titanate glass-ceramic thin films for integrated high-dielectric media Thin Solid Films 408 11-4
    • (2002) Thin Solid Films , vol.408 , Issue.1-2 , pp. 11-14
    • Yao, K.1    Zhu, W.2
  • 7
    • 17444408142 scopus 로고    scopus 로고
    • Dielectric degradation and microstructures of heterogeneous interfaces in cofired multilayer ceramic capacitors
    • DOI 10.1007/s10832-005-0960-9
    • Feng Q and McConville C J 2005 Dielectric degradation and microstructures of heterogeneous interfaces in cofired multilayer ceramic capacitors J. Electroceram. 14 213-20 (Pubitemid 40537769)
    • (2005) Journal of Electroceramics , vol.14 , Issue.3 , pp. 213-220
    • Feng, Q.1    McConville, C.J.2
  • 8
    • 0035455045 scopus 로고    scopus 로고
    • DC-electrical degradation of the BT-based material for multilayer ceramic capacitor with Ni internal electrode: Impedance analysis and microstructure
    • Chazono H and Kishi H 2001 DC-electrical degradation of the BT-based material for multilayer ceramic capacitor with Ni internal electrode: impedance analysis and microstructure Japan. J. Appl. Phys. 40 5624
    • (2001) Japan. J. Appl. Phys. , vol.40 , Issue.PART 1 , pp. 5624
    • Chazono, H.1    Kishi, H.2
  • 9
    • 0037763893 scopus 로고    scopus 로고
    • Reliability estimation and failure analysis of multilayer ceramic chip capacitors
    • Yang S J, Kim J W, Ryu D S, Kim M S and Jang J S 2003 Reliability estimation and failure analysis of multilayer ceramic chip capacitors Int. J. Mod. Phys. B 17 1318-23
    • (2003) Int. J. Mod. Phys. , vol.17 , Issue.8-9 , pp. 1318-1323
    • Yang, S.J.1    Kim, J.W.2    Ryu, D.S.3    Kim, M.S.4    Jang, J.S.5
  • 10
    • 71049180621 scopus 로고    scopus 로고
    • Exfoliating method for ceramic green sheet
    • Korea Patent 1020030077051
    • Samsung Electro-Mechanics 2005 Exfoliating method for ceramic green sheet Korea Patent 1020030077051
    • (2005) Samsung Electro-Mechanics
  • 11
    • 62749196663 scopus 로고    scopus 로고
    • 2S:Tb scintillators pixelated with polyethylene microstructures for digital x-ray image sensors
    • 2S:Tb scintillators pixelated with polyethylene microstructures for digital x-ray image sensors J. Micromech. Microeng. 19 015014
    • (2009) J. Micromech. Microeng. , vol.19 , Issue.1 , pp. 015014
    • Jung, I.D.1    Al, E.2
  • 12
    • 0033732466 scopus 로고    scopus 로고
    • Hot embossing as a method for the fabrication of polymer high aspect ration structures
    • Becker H and Heim U 2000 Hot embossing as a method for the fabrication of polymer high aspect ration structures Sensors Actuators A 83 130-5
    • (2000) Sensors Actuators , vol.83 , Issue.1-3 , pp. 130-135
    • Becker, H.1    Heim, U.2
  • 14
    • 33845215366 scopus 로고    scopus 로고
    • Preparation of ultra fine nickel-copper bimetallic powder for BME-MLCC
    • DOI 10.1016/j.mejo.2006.09.013, PII S0026269206002187
    • Songping W 2007 Preparation of ultra fine nickel copper bimetallic powder for BME-MLCC Microelectron. J. 38 41-6 (Pubitemid 44855797)
    • (2007) Microelectronics Journal , vol.38 , Issue.1 , pp. 41-46
    • Songping, W.1
  • 15
    • 38949097734 scopus 로고    scopus 로고
    • 3 powders in nonaqueous suspension with phosphate ester and their applications for MLCC
    • 3 powders in nonaqueous suspension with phosphate ester and their applications for MLCC J. Eur. Ceram. Soc. 28 1205-12
    • (2008) J. Eur. Ceram. Soc. , vol.28 , Issue.6 , pp. 1205-1212
    • Chu, L.W.1    Prakash, K.N.2    Tsai, M.T.3    Lin, I.N.4
  • 17
    • 0032682985 scopus 로고    scopus 로고
    • A novel integrated thin film capacitor realized by a multilayer ceramic-electrode sandwich structure
    • Grossmann M, Solwak R, Hoffmann S, John H and Waser R 1999 A novel integrated thin film capacitor realized by a multilayer ceramic-electrode sandwich structure J. Eur. Ceram. Soc 19 1413-5
    • (1999) J. Eur. Ceram. Soc , vol.19 , Issue.6-7 , pp. 1413-1415
    • Grossmann, M.1    Solwak, R.2    Hoffmann, S.3    John, H.4    Waser, R.5
  • 19
    • 0346936444 scopus 로고    scopus 로고
    • Residual stresses in multilayer ceramic capacitors: Measurement and computation
    • Toonder J M J, Rademaker C W and Hu C L 2003 Residual stresses in multilayer ceramic capacitors: measurement and computation J. Electron. Packag. 125 506-11
    • (2003) J. Electron. Packag. , vol.125 , Issue.4 , pp. 506-511
    • Toonder, J.M.J.1    Rademaker, C.W.2    Hu, C.L.3
  • 21
    • 0343550309 scopus 로고    scopus 로고
    • Polymer microfabrication methods for microfluidic analytical applications
    • Becker H and Gärtner C 2000 Polymer microfabrication methods for microfluidic analytical applications Electrophoresis 21 12-26
    • (2000) Electrophoresis , vol.21 , Issue.1 , pp. 12-26
    • Becker, H.1    Gärtner, C.2
  • 22
    • 29144455448 scopus 로고    scopus 로고
    • A novel fabrication method of flexible and monolithic 3D microfluidic structures using lamination of SU-8 films
    • Abgrall P, Lattes C, Conédéra V, Dollat X, Colin S and Gué A M 2006 A novel fabrication method of flexible and monolithic 3D microfluidic structures using lamination of SU-8 films J. Micromech. Microeng. 16 113-21
    • (2006) J. Micromech. Microeng. , vol.16 , Issue.1 , pp. 113-121
    • Abgrall, P.1    Lattes, C.2    Conédéra, V.3    Dollat, X.4    Colin, S.5    Gué, A.M.6
  • 24
    • 0036734816 scopus 로고    scopus 로고
    • A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist
    • Lin C H, Lee G B, Chang B W and Chang G L 2002 A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist J. Micromech. Microeng. 12 590-9
    • (2002) J. Micromech. Microeng. , vol.12 , Issue.5 , pp. 590-599
    • Lin, C.H.1    Lee, G.B.2    Chang, B.W.3    Chang, G.L.4
  • 25
    • 0036544396 scopus 로고    scopus 로고
    • High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist
    • Tseng F G and Yu C S 2002 High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist Sensors Actuators A 97-98 764-70
    • (2002) Sensors Actuators , vol.97-98 , Issue.1-2 , pp. 764-770
    • Tseng, F.G.1    Yu, C.S.2
  • 26
    • 33747242692 scopus 로고    scopus 로고
    • A thick photoresist process for advanced wafer level packaging application using JSR THB-151N negative tone UV photoresist
    • Rao V S, Kripesh V, Yoon S W and Tay A O 2006 A thick photoresist process for advanced wafer level packaging application using JSR THB-151N negative tone UV photoresist J. Micromech. Microeng. 16 1841-6
    • (2006) J. Micromech. Microeng. , vol.16 , Issue.9 , pp. 1841-1846
    • Rao, V.S.1    Kripesh, V.2    Yoon, S.W.3    Tay, A.O.4
  • 27
    • 41149125384 scopus 로고    scopus 로고
    • Nickel microneedles fabricated by sequential copper and nickel electroless plating and copper chemical wet etching
    • Jung P G, Lee T W, Oh D J, Hwang S J, Jung I D, Lee S M and Ko J S 2008 Nickel microneedles fabricated by sequential copper and nickel electroless plating and copper chemical wet etching Sensors Mater. 20 45-53
    • (2008) Sensors Mater. , vol.20 , pp. 45-53
    • Jung, P.G.1    Lee, T.W.2    Oh, D.J.3    Hwang, S.J.4    Jung, I.D.5    Lee, S.M.6    Ko, J.S.7
  • 30
    • 0037427253 scopus 로고    scopus 로고
    • A photocurable poly(dimethylsiloxane) chemistry designed for soft lithographic molding and printing in the nanometer regime
    • Choi K M and Rogers J A 2003 A photocurable poly(dimethylsiloxane) chemistry designed for soft lithographic molding and printing in the nanometer regime J. Am. Chem. Soc. 125 4060-1
    • (2003) J. Am. Chem. Soc. , vol.125 , Issue.14 , pp. 4060-4061
    • Choi, K.M.1    Rogers, J.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.