Comparative electromigration performance of pb free flip chip joints with varying board surface condition

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 914-921

  Nicholls, Lou ^a   Darveaux, Robert ^a   Syed, Ahmer ^b   Loo, Shane ^b   Tee, Tong Yan ^c   Wassick, Thomas A ^d   Batchelor, Bill ^d  

^a AMKOR TECHNOLOGY   (United States)

^b AMKOR TECHNOLOGY   (Singapore)

^c IBM   (United States)

^d SiXis Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIONAL KNOWLEDGE; BASE SURFACE; ELECTRONIC COMPONENT; FLIP CHIP; FLIP CHIP INTERCONNECTS; FLIP CHIP JOINTS; HAZARDOUS SUBSTANCES; HIGH-VOLUME PRODUCTION; INTERCONNECT SYSTEMS; PB-FREE; ROHS DIRECTIVE; SEMICONDUCTOR INDUSTRY; SURFACE CONDITIONS; VIABLE SOLUTIONS;

DATABASE SYSTEMS; ELECTROMIGRATION; HAZARDOUS MATERIALS; LEAD; SEMICONDUCTOR DEVICE MANUFACTURE;

PAPER LAMINATES;

EID: 70349670744     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074122     Document Type: Conference Paper

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