A study of electromigration failure in PB-free solder joints

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2005, Pages 518-523

  Ding, Min ^a   Wang, Guotao ^a   Chao, Brook ^a   Ho, Paul S ^a   Su, Peng ^b   Uehling, Trent ^b   Wontor, David ^b  

^a The University of Texas at Austin   (United States)

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Electromigration; Pb free; Under bump metallization

Indexed keywords

PB-FREE; SOLDER BUMPS; TEMPERATURE DEPENDENCE; UNDER BUMP METALLIZATION;

ACTIVATION ENERGY; CRACKS; ELECTROMIGRATION; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; LEAD; METALLIZING; SAMPLING; SCANNING ELECTRON MICROSCOPY;

SOLDERED JOINTS;

EID: 27744574109     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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