Electromigration in Pb-free solder bumps with Cu column as flip chip joints

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 657-662

  Nah, Jae Woong ^a   Suh, J O ^a   Tu, K N ^a   Yoon, Seung Wook ^b   Chong, Chai Tai ^b   Kripesh, V ^b   Su, B R ^c   Chen, Chih ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COLUMN BUMPS; FLIP CHIP JOINTS; HIGH CURRENT STRESSING; SOLDER BUMPS;

ELECTRIC RESISTANCE; ELECTROMIGRATION; EUTECTICS; FLIP CHIP DEVICES; LEAD;

SOLDERED JOINTS;

EID: 33845566147     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645720     Document Type: Conference Paper

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