Theoretical study on the influence of residual stress on adhesion-induced instability in MEMS

Chinese Science Bulletin

Volumn 54, Issue 15, 2009, Pages 2606-2609

  Wang, Shi Ji ^a,b   Li, Xian ^a   Chen, Zheng Han ^b  

^a SOUTHWEST UNIVERSITY   (China)

^b Logistical Engineering University of PLA   (China)

Author keywords

Adhesion; Adhesion induced instability; MEMS; Residual stress

Indexed keywords

EID: 70349410728     PISSN: 10016538     EISSN: 18619541     Source Type: Journal    
DOI: 10.1007/s11434-009-0379-9     Document Type: Article

References (21)

1. Huan Y, Zhang T H, Yang Y M. In-plane load measuring technique for the strength test of MEMS micro-cantilever. Chinese Sci Bull, 2006, 51: 2819-2823
2. Maboudian R, Howe R T. Critical review: Adhesion in surface micromechanical structures. J Vac Sci Tech B, 1997, 15: 1-20
3. Mastrangelo C H. Adhesion-related failure mechanisms in micromechanical devices. Tribol Lett, 1997, 3: 223-238
4. Zhao Y P, Wang L S, Yu T X. Mechanics of adhesion in MEMS-a review. J Adhes Sci Tech, 2003, 17: 519-546
5. Rogers J W, Mackin T J, Phinney L M. A thermomechanical model for adhesion reduction of MEMS cantilevers. J Micromech Microeng, 2002, 11: 512-520
6. Jones E E, Begley M R, Murphy K D. Adhesion of micro-cantilevers subjected to mechanical point loading: Modeling and experiments. J Mech Phys Solids, 2003, 51: 1601-1622
7. Lin M J, Chen R S. Adhesion criterion for center-anchored circular plates in microstructures. Sensors Actuat A-Phys, 2002, 101: 14-23
8. Yang F Q. Adhesive contact of axisymmetric suspended miniature structure. Sensors Actuat A-Phys, 2003, 104: 44-52
9. Yang F Q. Contact deformation of a micromechanical structure. J Micromech Microeng, 2004, 14: 263-268
10. Serry F M, Walliser D, Maclay G J. The role of the Casimir effect in the static deflection and stiction of membrane strips in microelectromechanical systems. J Appl Phys, 1998, 84: 2501-2506
11. Su Y H, Chen K S, Roberts D C, et al. Large deflection analysis of a pre-stressed annular plate with a rigid boss under axisymmetric loading. J Micromech Microeng, 2001, 11: 645-653
12. Wan K T, Kogut L. The coupling effect of interfacial adhesion and tensile tension residual stress on a thin membrane adhered to a flat punch. J Micromech Microeng, 2005, 15: 778-784
13. Ding J N, Meng Y G, Wen S Z. Scale dependence of tensile strength of micromachined polysilicon MEMS structures due to microstructural and dimensional constraints. Chinese Sci Bull, 2001, 46: 1392-1397
14. Yang F Q. Electromechanical instability of microscale structures. J Appl Phys, 2002, 92: 2789-2794
15. Timoshenko S P, Woinowsky-Krieger S. Theory of Plates and Shells. New York: McGraw-Hill Press, 1959
16. Wan K T, Duan J. Adherence of a rectangular flat punch onto a clamped plate: Transition from a rigid plate to a flexible membrane. J Appl Mech, 2002, 69: 104-109
17. Lu C F, Chen W Q, Zhong Z. Two-dimensional thermoelasticity solution for functionally graded thick beams. Sci China Ser G, 2006, 49: 451-460
18. Wang S J, Li X. The effects of tensile residual stress and sliding boundary on measuring the adhesion work of membrane by pull-off test. Thin Solid Films, 2007, 515: 7227-7231
19. Sun Z, Wan K T, Dilard D A. A theoretical and numerical study of thin film delamination using the pull-off test. Int J Solids Struct, 2004, 41: 717-730
20. Duan J, Wan K T, Chian K S. Mechanical integrity and adhesion of thin films for applications inelectronics packaging and cell biology. Thin Solid Films, 2003, 424: 120-124
21. Zhang Y, Zhao Y P. An effective method of determining the residual stress gradients in a micro-cantilever. Microsyst Tech, 2006, 12: 357-364