Mechanical integrity and adhesion of thin films for applications in electronics packaging and cell biology

Thin Solid Films

Volumn 424, Issue 1, 2003, Pages 120-124

  Duan, Jin ^a   Wan, Kai Tak ^a   Chian, Kerm Sin ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Adherence model; Axisymmetric punch; Bio adhesion; Mechanical integrity; Thin flexible membrane; Tribology

Indexed keywords

ADHESION; BENDING (DEFORMATION); ELASTIC MODULI; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MATHEMATICAL MODELS;

MECHANICAL INTEGRITY;

THIN FILMS;

EID: 0037460348     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00910-0     Document Type: Conference Paper

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