Scale dependence of tensile strength of micromachined polysilicon MEMS structures due to microstructural and dimensional constraints

Chinese Science Bulletin

Volumn 46, Issue 16, 2001, Pages 1392-1397

  Ding, J ^a   Meng, Y ^a   Wen, S ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Elastic modulus; Microelectromechanical systems; Polysilicon; Size effect; Tensile strength

Indexed keywords

SILICONE;

ARTICLE; ELECTRONICS; FILM; MACHINE; MATERIALS; MATERIALS TESTING; MECHANICS; STATISTICAL ANALYSIS; TECHNOLOGY; TENSILE STRENGTH; YOUNG MODULUS;

EID: 0034802239     PISSN: 10016538     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03183397     Document Type: Article

References (14)

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8. Mechanical deflection of polysilicon microcantilever beams using nanoindentation
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