Large deflection analysis of a pre-stressed annular plate with a rigid boss under axisymmetric loading

Journal of Micromechanics and Microengineering

Volumn 11, Issue 6, 2001, Pages 645-653

  Su, Y H ^a   Chen, K S ^b   Roberts, D C ^c   Spearing, S M ^c  

^a Stony Brook University   (United States)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); DEFLECTION (STRUCTURES); MICROELECTROMECHANICAL DEVICES; PRESTRESSING; STIFFNESS; STRUCTURAL DESIGN; STRUCTURAL LOADS;

AXISYMMETRIC LOADING;

PLATES (STRUCTURAL COMPONENTS);

EID: 0035506995     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/6/305     Document Type: Article

References (11)

1. A pressure-balanced electrostatically-actuated microvalve
2. Development of micro hydraulic transducer technology
3. Wafer-to-wafer bonding for microstructure
4. Bending of circular plates with large deflection
5. The influence of tensile forces on the deflection of circular diaphragms in pressure sensors
6. Large deflections of clamped circular plates under initial tension and transitions to membrane behavior
7. Calculated elastic constants for stress problems associated with semiconductor devices