A new creep constitutive model for eutectic solder alloy

Journal of Electronic Packaging

Volumn 124, Issue 2, 2002, Pages 85-90

  Shi, X Q ^a   Wang, Z P ^a   Zhou, W ^b   Pang, H L J ^b   Yang, Q J ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002934914     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1462624     Document Type: Article

References (13)

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2. Pao, Y. H., Badgley, S., Jih, E., Govila, R., and Browning, J., 1993, "Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints," ASME J. Electron. Packag., 115, pp. 147-152.
3. Darveaux, R., and Banerji, K., 1992, "Constitutive Relations for Tin-Based Solder Joints," IEEE CHMT-A, 15, pp. 1013-1024.
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8. Hertzberg, R. W., 1996, Deformation and Fracture Mechanics of Engineering Materials, Wiley, New York.
9. Frost, H. J., and Ashby, M. F. 1982, Deformation-Mechanism Maps - The Plasticity and Creep of Metals and Ceramics, Pergamon Press, New York.
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11. McCabe, R. J., and Fin, M. E., 1998, "Athermal and Thermally Activated Plastic Flow in Low Melting Temperature Solders at Small Stresses," Scr. Mater., 39, No. 2, pp. 189-195.
12. Lau, J., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, Flip Chip, CSP, and Fine Pitch SMT Assemblies, Van Nostrand Reinhold, New York.
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